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Title:
MODULAR CAPILLARY PUMPED LOOP COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO2003025475
Kind Code:
A3
Abstract:
The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or more evaporators (10) connected to one or more condensers (12) via flexible liquid transport and vapor transport lines (16, 14). A wicking structure (20) is disposed within each evaporator (10). The wicking structure (20) draws working fluid (e.g., water) in a liquid state into the evaporator (10) based on a capillary mechanism and a pressure differential across a meniscus formed at the liquid/vapor interface on an upper surface of the wicking structure (20). At this interface, liquid evaporates and absorbs energy from the heat source (22). The energy is transported by the vapor to the condenser (12) where the working fluid is condensed back into liquid, thereby releasing the energy.

Inventors:
CHESSER JASON
FANEUF BARRETT
MONTGOMERY STEPHEN
Application Number:
PCT/US2002/027857
Publication Date:
June 19, 2003
Filing Date:
August 29, 2002
Export Citation:
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Assignee:
INTEL CORP (US)
International Classes:
F28D15/04; G06F1/20; H01L23/427; H05K7/20; (IPC1-7): F28D15/04; H01L23/427
Foreign References:
US5761037A1998-06-02
US4890668A1990-01-02
US5940270A1999-08-17
FR2813662A12002-03-08
US6257323B12001-07-10
US5725049A1998-03-10
US6227286B12001-05-08
GB2190737A1987-11-25
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 24 11 May 2001 (2001-05-11)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31)
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