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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/059846
Kind Code:
A modular structure, comprising a first module and a second module, said first and second modules moveably coupled to each other by an engagement assembly, wherein the first module is arranged to be nested within the second module when the modular structure is in an unextended position, and wherein the engagement assembly further comprises a guide mechanism arranged to allow translation of the first or second module relative to each other from the unextended position to an extended position.

POH, Qi Pin (143 Potong Pasir Avenue 2, #13-20, Singapore 3, 350143, SG)
Application Number:
Publication Date:
June 06, 2019
Filing Date:
September 19, 2018
Export Citation:
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POH, Qi Pin (143 Potong Pasir Avenue 2, #13-20, Singapore 3, 350143, SG)
International Classes:
E04B1/343; B65D88/00; B65D88/52; E04B1/344; E04B1/348; E04H1/00; E04H1/02; E04H1/12
Attorney, Agent or Firm:
ONG, Marcus Zhi Ping (Marks & Clerk Singapore LLP, Tanjong Pagar,,P O Box 636, Singapore 6, 910816, SG)
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