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Patent Searching and Data


Title:
MODULAR SENSOR INTERFACE AND IOT SENSOR DEVICE PACKAGE WITH SAME APPLIED THERETO
Document Type and Number:
WIPO Patent Application WO/2019/168212
Kind Code:
A1
Abstract:
A modular sensor interface and an IoT sensor device package with same applied thereto are provided. A sensor device package according to an embodiment of the present invention comprises: a connector to which a sensor module is connected; and a device module that recognizes a protocol of the sensor module connected to the connector and communicates with the sensor module with the recognized protocol. Therefore, through the IoT sensor device package to which the modular sensor interface standard technology for connection/use of various sensor modules are applied, an IoT device can be equipped with various sensors in a plug & play manner. Accordingly, when a desired type of information or sensor is changed, data can be received by replacing only the sensor module.

Inventors:
JI YOUNG MIN (KR)
Application Number:
KR2018/002392
Publication Date:
September 06, 2019
Filing Date:
February 27, 2018
Export Citation:
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Assignee:
KOREA ELECTRONICS TECHNOLOGY (13509, KR)
International Classes:
H04L29/06; H04L12/24
Foreign References:
KR20110123652A2011-11-15
KR20150034425A2015-04-03
US20160135241A12016-05-12
CN205028089U2016-02-10
KR101452692B12014-10-21
Attorney, Agent or Firm:
NAM, Choong Woo (06296, KR)
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