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Title:
MODULAR SENSOR PLATFORM APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/119111
Kind Code:
A1
Abstract:
Disclosed is a modular sensor platform apparatus. The modular sensor platform apparatus comprises at least one first terminal that can couple to a power sensor, a plurality of second terminals that can couple to an external sensor module and a communication module, and a microcontroller unit for executing a previously defined algorithm.

Inventors:
AHN SUNG-HOON (KR)
KIM SEUNG-GI (KR)
JUNG GUYEOP (KR)
Application Number:
PCT/KR2021/014256
Publication Date:
June 09, 2022
Filing Date:
October 14, 2021
Export Citation:
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Assignee:
SEOUL NAT UNIV R&DB FOUNDATION (KR)
International Classes:
G01R22/06; G01R19/25; G01R21/133; G01R22/10
Foreign References:
KR101791030B12017-11-20
KR20170012857A2017-02-03
US20050075808A12005-04-07
KR20180058113A2018-05-31
US20080224690A12008-09-18
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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