HIDDEN HEAT EXCHANGER

DESCRIPTION

[0001] This application claims priority of U.S. Provisional Serial No. 61/798,630, filed March 15, 2013 and entitled "Hidden Heat Exchanger", the disclosure of said provisional application being incorporated herein by this reference.

BACKGROUND OF THE DISCLOSED TECHNOLOGY

Γ00021 Field of the Disclosed Technology

[0003] The subject disclosed technology relates to a heat exchange system for the collection and transformation of solar energy into useful heat energy. The proposed system uses a heat pipe module that collects solar energy with a solar surface, and transfers the collected heat to a first heat transfer media within the heat pipe, which first media transfers the heat via a two-phase convective and conductive process to an external surface of the heat pipe in its condenser section. The heat pipe condenser external surface is thermally connected to a conductive heat transfer block. Several heat pipes may be connected to each heat transfer block. The heat transfer block is used to connect the heat pipe to a heat exchanger assembly both thermally and structurally. An external surface area of the heat exchanger assembly is thermally connected to the heat transfer block. The heat exchanger assembly has within it a circulating second heat transfer media. The heat pipe module and heat exchanger assembly are insulated within an external frame, increasing efficiency by minimizing heat loss.

Γ00041 Related Art

[0005 Solar heat pipe and heat exchanger systems currently available do not optimally combine a simple design that is easy to assemble and yet efficient at gathering, transferring and preserving heat. Current designs have yet to optimally couple, for example, the condenser section of the heat pipe subassembly with the heat exchanger for best transfer of heat to the exchanger's heat transfer media.

[0006] A current design for a heat pipe module and heat exchanger assembly system is a heat pipe condenser and header combination as disclosed, for example, in U.S. Pat. No. 4,313,423 (Mandjuri). The strategy of this design is to contain the condenser regions of the heat pipes within the heat exchanger header. The condenser regions have fins attached to best transfer the heat. The condenser regions of the heat pipes fit into ports along the length of the heat exchanger header. By placing the condenser regions of the heat pipes inside the heat exchanger, the design is simplified, however replacing broken parts or maintaining current parts is not most efficient. To maintain or replace a heat pipe, for example, the heat transfer media flowing through the heat exchanger has to be drained, and then the heat pipe and its finned condenser region be removed. Therefore, this solution provides a heat pipe module and heat exchanger assembly system, but does not optimally provide an easy to construct and maintain solution.

[0007] Another current general detail of heat pipe and heat exchanger systems is the need to weld components together to assemble the complete system. This can be, for example, a connection between the heat pipe module mount and heat exchanger that is welded, cemented, or soldered to the connecting surfaces. These types of connection methods require experienced skills and special tools to install, increasing the difficulty and cost of installation. Additionally, if the structural or thermal connection is welded to its connected parts, then maintenance or repair of the part may be difficult. After filling and sealing, the heat pipes become temperature sensitive. Once parts are fused together using these more permanent methods, a part may not be able to be replaced easily without damaging the integrated heat pipes, and may instead require an extensive rebuild of a portion of the system. Thus, current designs that use welding, cementing, soldering or other more permanent connections tend to be overly complicated, creating a system that is more difficult to install, maintain and repair over time.

[0008] To date there has not been a heat pipe and heat exchanger system that is optimally convenient and economical to put together and maintain, yet efficient at gathering, retaining, and transferring heat. Current designs with heat pipes being contained within header assemblies or with important components being substantially permanently fused together are not optimal. These designs take extra skill, time, and cost to assemble, maintain, and repair. The proposed technology herein provides one solution for a heat pipe and heat exchanger system that is shipped from the factory with its component parts fully manufactured, partially pre-assembled and ready for convenient and economical final assembly. Therefore, the technology herein provides a system which is simple to install, maintain and repair using modular parts that fit together using common fasteners and swap out for each other easily, without the need for special skills or tools. The modular design of the subject apparatus also allows several assemblies to be connected in series or parallel, creating an array of the heat pipe and heat exchanger assemblies. The proposed technology also provides a highly efficient, self-insulating, all-encompassing frame to prevent heat loss, with large external surface areas for superior amounts of heat collection and large internal surface areas for superior amounts of heat transfer. Preferably, special solar panels with anti-reflective and low- emission coatings trap and absorb a maximum amount of solar energy. Thus, the heat pipe module and heat exchanger assembly system of the disclosed technology is highly efficient, with ease and economy of construction, maintenance and repair, and maximization of solar collection efficiency.

SUMMARY OF THE DISCLOSED TECHNOLOGY

[0009] A self-insulated heat pipe module and heat exchanger assembly system to collect and transfer heat from solar energy for useful thermal energy, is disclosed. This apparatus is comprised of a heat pipe module and a heat exchanger assembly. Also, the apparatus may have a preferred set of support tracks and mounting plates for convenient and effective adjustable installation anywhere. Several heat pipe modules may be employed with each heat transfer assembly. A modular design allows for varying the number of heat pipe modules and heat exchanger assemblies to be connected together in series or parallel, creating an arrayed system in a heat exchange circuit.

[0010] The subject heat pipe module and heat exchanger assembly is contained within the frame perimeter of the apparatus so that the heat exchanger is substantially hidden from external view by the heat pipe module assembly and backside and bottomside insulation under normal operating conditions. Each hidden heat exchanger assembly contains a preferably extruded heat exchanger body, an insulator, and optionally a heat transfer plenum subassembly. A preferred embodiment of the heat exchanger body is an aluminum extrusion to make an encompassing volume, with large interior surface area to be contacted by a circulating heat transfer media, and a large exterior surface area secured in heat conductive contact with the heat pipes' supporting heat transfer blocks. Larger contact surface areas increase the efficiency of the heat pipe and heat exchanger assembly. The exposed surface of the hidden heat exchanger body not covered by insulation is attached via heat transfer blocks to the exposed surface of the external condenser ends of the heat pipes. Attached insulation prevents any unwanted heat loss from occurring, thus promoting an overall higher efficiency. Plenum subassemblies may be attached onto either lateral side of one or more heat exchanger assemblies when connected to the heat exchange circuit, to help equalize inlet and outlet pressure, and create a more uniform flow of circulating heat transfer media.

[0011] The heat pipe module is comprised of a frame subassembly, multiple heat pipe subassembly, and a solar energy collecting panel subassembly. The multiple heat pipe

subassemblyincludes preferably aluminum solar absorber fins with preferably selective surface high solar absorptivity, low emissivity coatings, conductively connected to heat pipes that may be of conventional design. The heat pipes transfer heat via a two-phase convective process through a first heat transfer media contained within the pipes along their length to their condenser ends, and conductively there to their condenser external ends and to the thermally connected heat transfer blocks. The heat pipes are preferably operated in gravity-assist mode thus eliminating the need for a wick structure of conventional design. The heat pipes are preferably unbalanced deliberately with relatively long evaporators and relatively short condensers. Optionally, preferably V-shaped inserts may be installed into the heat pipe condensers, to increase the surface area there for condensation. In addition, the preferably V-shaped inserts may help scavenge excess liquid away from the internal wall of the condenser by forming variable-volume liquid fillets at the contact points of the insert and wall. This way, the flowing condensed stream of working fluid may be divided into several smaller streams for increased heat transfer efficiency. The heat transfer blocks are connected to the external condenser sections of the heat pipes, as well as to an external surface of the heat exchanger body not covered by insulation, and provide both a structural and thermally conductive inter-connection therebetween.

[0012] The heat pipe module frame subassembly provides both structural support and insulation for the heat pipe module and heat exchanger assembly. The frame subassembly is preferably made out of extruded plastic sheeting or other suitable material. Air gaps are left inside the frame subassembly to help insulate the heat pipe module and minimize heat loss. One end of the frame subassembly has an external gap, providing a space for the hidden heat exchanger body to mount therein to the heat transfer blocks of the multiple heat pipe subassemblies.

[0013] The solar energy collecting panel subassembly is comprised of panels of extruded plastic or other suitable sheet-like materials. The panels are preferably made of ultraviolet- resistant materials, preferably polycarbonate or acrylic, to prolong their life span. Preferably, on each panel is an anti-reflective coating, designed to take in as much solar energy as possible. Preferably, on each panel also is an infrared-reflective coating, which allows solar radiation to enter the apparatus, but reduces radiation heat loss by preventing the infrared energy from leaving through the panel. Optionally, multiple panels may be stacked on top of each other in the panel subassembly.

Preferably, an air gap surrounds and separates each panel in the panel subassembly, providing additional insulation and reduced heat loss.

[0014] The heat pipe module and heat exchanger assembly provides a self-insulating system that gathers heat from its solar surfaces, and transfers the heat to heat transfer medias using its encompassed heat pipes and hidden heat exchanger. The modular design of the system allows a number of heat pipe modules and heat exchanger assemblies to be fastened in series or parallel in a heat exchange circuit.

[0015] Preferably, for economic commercial delivery, the subject heat pipe module is provided in a size and weight so that it may be conveniently and economically shipped by a national or international package delivery service, for example, DHL™, FEDEX™, or UPS™. Applicants can package three heat pipe modules (with each module containing four heat pipes, two sets of fins, two heat transfer blocks, three insulated frames with panels), a heat exchanger assembly, and two support tracks and four mounting plates, all in a sturdy box with length plus girth (2 times width plus 2 times height) totaling less than 130 inches, and weighing less than 100 pounds, in order to meet the requirements for economical national/international package delivery. This way, Applicants' subject technology may be conveniently ordered, economically shipped, and easily installed anywhere in the world.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG. 1 is an isometric view of the subject inventive heat pipe module and heat exchanger assembly system (800). "F" with arrows designates heat transfer media flow. "R" with arrows designates incoming solar radiation.

[0017] FIG. 2 is an isometric view of a subject heat pipe module and heat exchanger assembly (700). Again, "F" shows heat transfer media flow, and "R" shows incoming solar radiation.

[0018] FIG. 3 is a side view of the heat pipe module and heat exchanger assembly of FIG 2.

[0019] FIG. 4 is a front view of t ^{h f} * ™™» ^m ^ ^{i i1 p} * ^{n ri} wrh vn nor assembly of FIG. 2. [0020] FIG. 5 is an isometric view of a subject heat pipe module (600). [0021] FIG. 6 is a side view of the heat pipe module of FIG. 5.

[0022] FIG. 7 is a cross-sectional front view of the heat pipe module, taken along line FIG. 7 - FIG.

7 of FIG. 6.

[0023] FIG. 8 is an isometric view of a subject frame subassembly (500). [0024] FIG. 9 is a side view of the frame subassembly of FIG. 8.

[0025] FIG. 10 is a cross-sectional front view of the frame subassembly, taken along line FIG. 10 - FIG. 10 of FIG. 9.

[0026] FIG. 11 is an exploded isometric view of the heat pipe module and heat exchanger

assembly (700) of FIG. 2.

[0027] FIG. 12 is an exploded view of the subject heat transfer components (300).

[0028] FIG. 13 is an isometric view of the heat transfer components of FIG. 12. "R" represents incoming solar radiation, "H" represents the flow of heat through the system, and "F" represents heat transfer media flow.

[0029] FIG. 13A is a detail isometric view of the end of a heat tube from the circled area of

FIG 13.

[0030] FIG. 14 is a front view of the heat transfer components from FIG. 12. "R" represents

incoming solar radiation, "H" represents the flow of heat through the system, and "F" represents heat transfer media flow. [0031] FIG. 15 is a back view of a multiple heat pipe subassembly (200), wherein "H" represents the flow of heat through the system.

[0032] FIG. 16 is an isometric view of the multiple heat pipe subassembly of FIG. 15.

[0033] FIG. 17 is a top view of the multiple heat pipe subassembly of FIG. 15.

[0034] FIG. 18 is a side view of the multiple heat pipe subassembly of FIG. 15.

[0035] FIG. 19 is a bottom view of the multiple heat pipe subassembly of FIG. 15.

[0036] FIG. 19A is a side, cross-sectional view of the multiple heat pipe subassembly, taken along line FIG. 19A - FIG. 19A of FIG. 19.

[0037] FIG. 20 is an isometric view of a heat exchanger subassembly (100).

[0038] FIG. 21 is a top view of the heat exchanger subassembly of FIG. 20.

[0039] FIG. 22 is a front view of the heat exchanger subassembly of FIG. 20.

[0040] FIG. 23 is a bottom view of the heat exchanger subassembly of FIG. 20.

[0041] FIG. 24 is a side view of the heat exchanger subassembly of FIG. 20.

[0042] FIG. 25 is an isometric view of a heat exchanger assembly (400).

[0043] FIG. 26 is an isometric view of the heat transfer components (300) as in FIG. 13. Differing from the embodiment shown in FIGS. 12-14, this embodiment uses a stud rather than a pin connection.

[0044 FIG. 27 is a front view of the heat transfer components of FIG. 26. [0045] FIG. 28 is a back view of multiple heat pipe subassembly (200), but for the stud connection embodiment.

[0046] FIG. 29 is an isometric view of the multiple heat pipe subassembly of FIG. 28.

[0047] FIG. 30 is a top view of the multiple heat pipe subassembly of FIG. 28.

[0048] FIG. 31 is a bottom view of the multiple heat pipe subassembly of FIG. 28.

[0049] FIG. 32 is an isometric view of a heat exchanger assembly (400), with studs to be used for the stud connection.

[0050] FIG. 33 is an isometric exploded view of the heat transfer components (300) of FIG. 26.

DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS OF THE DISCLOSED TECHNOLOGY

[0051] Seen in the Figures of the subject disclosed technology are several, but not all, of the embodiments of an invented heat pipe module and heat exchanger assembly system. Differing fastening options and a modular component design, for example, allow for multiple embodiments of this heat pipe module and heat exchanger assembly system. [00] Depicted in the Figures are several groups of call-out items, namely:

Group 100 - heat exchanger subassembly, see Figures 20 - 24 (not to be confused with Group 400 below - heat exchanger assembly);

Group 200 - heat pipe subassembly, see Figures 15-19A, and 28-31 (not to be confused with Group 600 below -heat pipe module); Group 300 - heat transfer components, see Figures 12 - 14, 26, 27, and 33;

Group 400 - heat exchanger assembly, see Figures 25 and 32;

Group 500 - frame subassembly, see Figures 8 - 10;

Group 600 - heat pipe module, see Figures 5-7;

Group 700 - heat pipe module and heat exchanger assembly, see figures 2-4 and 11 (not to be confused with Group 800 below - heat pipe module and heat exchanger assembly system); and Group 800 - heat pipe module and heat exchanger assembly system, see Figure 1.

[0052] FIG. 1 illustrates a preferred embodiment of a heat pipe module and heat exchanger assembly system 800. The heat pipe module and heat exchanger assembly system 800 is comprised of several connected heat pipe module and heat exchanger assemblies 700 (see FIG.'s 2-4 and 11). In FIG. 1 an isometric view of three heat pipe modules 600 and hidden heat exchanger assemblies 400 are shown fastened together. When fastened together, a heat pipe module 600 and a hidden heat exchanger assembly 400 become a heat pipe module and heat exchanger assembly 700. If desired, several or numerous heat pipe module and heat exchanger assemblies 700 may be connected to each other to form joint solar collectors in a heat pipe module and heat exchanger assembly system 800 that may extend to 50 feet or more in length. Also shown in FIG. 1, represented by arrows and the letter "R", is incident solar radiation 270 which is used to heat the heat pipe module and heat exchanger assembly system 800. Heat is gathered by the heat pipe module and heat exchanger assembly system 800, and via a two phase convective and conductive process is transferred into a heat transfer media represented by arrows and the letter "F" 150.

[0053] FIGS. 2-4 and 11 are views of a preferred embodiment of the heat pipe module and heat exchanger assembly 700. In heat pipe module and heat exchanger assembly 700 is a hidden heat exchanger assembly 400, a heat pipe module 600 (in this case with the pin connector embodiment), a panel subassembly 610, an upper support track 710, and lower support track 720. The shown embodiment of the support tracks 710 and 720 are made of four components; the track tongue 711, the track top surface 712, the track vertical wall 713, and the track bottom 714. The track tongue 711 and track top surface 712 mate to the heat pipe module assembly 600 and limit the amount of vertical movement allowed in the heat pipe module and heat exchanger assembly 700. The track vertical wall 713 sets the distance between the heat pipe module and heat exchanger assembly 700 and the mounting surface to which the support tracks are attached. The track bottom 714 will preferably have fasteners, which penetrate its body and secure the tracks 710 and 720 to the mounting surface.

[0054] FIGS. 5-7 are views of the heat pipe module 600. The heat pipe module 600 is comprised of multiple heat pipe subassemblies 200 (see FIG.'s 15- 19 A, and 28-31), a frame subassembly 500 (see FIG.'s 8-10), a panel subassembly 610, and, in this case with the connector embodiment, also pin retainers 650 and pin retainer fasteners 651. The pin retainers 650 secure and lock the pin 170 (see FIG. 4) into place when using the pin hole stud 130 mounting for this embodiment (see FIG. 12). This way, the heat blocks 230 and the connected fins 220 that secure the heat pipes 210 to the heat blocks 230 may be conveniently and quickly secured together by inserting pin 170 through pin hole stud 130 by hand, without the aid of any tools. A preferred embodiment of the panel subassembly 610 is made up of four preferably extruded plastic bezel sides (see FIG. 5); they are the right bezel 611, the left bezel 612, the top bezel 613, and the bottom bezel 614. Each bezel connects to two other bezels, and contains the plastic panel 620 within the channel 615. The components of the panel subassembly 610 typically adhere together with an epoxy or other suitable adhesive material. In a preferred embodiment of the panel 620, the panel material may be ultraviolet-resistant ("UV-resistant) polycarbonate, UV-resistant acrylic, or other suitable material to best withstand solar effects over time. On the top side of panel 620 is preferably a top coating 621 (see FIG. 7). The top coating 621 is an anti-reflective coating, designed to take in as much solar energy as possible. On the bottom side of panel 620 is preferably a bottom coating 622, The bottom coating 622 is an infrared-reflective coating, which allows solar radiation to enter the apparatus, but reduces radiation heat loss by preventing the infrared energy from leaving through the panel 620.

[0055] As seen in FIG.7, the condenser section (or "condenser region") is typically 9 - 15% of the total length of the heat pipe at the end of the heat pipe nearest to the heat transfer block 230. The heat pipe 210 optionally contains within it a "V"-shaped insert 211. "V" 211 is a thermally conductive insert that may reduce the liquid layer thickness on the inside surface of the condenser region of heat pipe 210, improving operating efficiency. The axial length of the "V" 211 is typically about 6 inches.

[0056] The frame subassembly 500, illustrated in an isometric view in FIG. 8, forms the primary structure and insulating body for the heat pipe module and hidden heat exchanger assembly 700. The four walls of the frame subassembly are made of preferably extruded plastic, they are the left frame wall 511, the right frame wall 512, the bottom frame wall 513, the top frame wall 514, and together they form the frame wall extrusion 510. In the following description of the frame subassembly 500, Applicants employ two conventions: a. "lower to higher" means

"generally left and toward the top of the drawing" in Fig. 8, and "toward the left of the drawing" in Figs. 9 and 10; and b. "lower to higher" also means "generally away from mount plates 540 toward heat exchanger notch 515" in Figs. 8 and 9. This latter convention applies because typically heat pipe module and heat exchanger assembly 700 is installed in "gravity assist" mode wherein the evaporation sections of the heat pipes are lower in elevation than the condenser sections. This way, when the vaporized working fluid in a heat pipe is condensed upon cooling in the "upper" condenser section, it flows by gravity force, back down to the "lower" evaporation section, for another cycle of boil and condense.

[0057] These above description conventions apply particularly to the following terms: bottom frame wall 513; top frame wall 514; heat exchanger bottom wall 516; heat exchanger top wall 517; lower floor 520; upper floor 521; lower bottom cover 550; upper bottom cover 551; lower insulating foam 560; upper insulating foam 561; upper track 710; and lower track 720.

[0058] To promote a higher efficiency of insulation the frame wall extrusion 510 may contain air pockets 505, which limit the thermal conductance of the walls 511, 512, 513, and 514. A hidden heat exchanger notch 515 is a cut out in the left frame wall 511, and the right frame wall 512. This hidden heat exchanger notch 515 accepts the hidden heat exchanger assembly 400, allowing it to mount to the multiple heat pipe subassembly 200.

[0059] A lower floor 520 and upper floor 521 are visible in FIG. 11. These floors are sheets of preferably extruded plastic sheeting. They provide both insulation and structure, by containing air cells within their rigid body. The lower floor 520 and upper floor 521 are contained by and adhered to the floor notch 501, located in the midsection of the frame wall extrusion 510 (see FIG. 10). Also seen in FIG. 11 is a lower bottom cover 550, and upper bottom cover 551. These covers are of preferably extruded plastic sheeting, and they provide both insulation and structure, by containing air cells within their rigid body. The lower bottom cover 550 and upper bottom cover 551 mate into the cover notch 502 located around the bottom perimeter of the frame wall extrusion 510 (see FIG. 10). These floors and bottom covers provide both structure and insulation for the heat pipe module and hidden heat exchanger assembly 700. [0060] A hidden heat exchanger bottom wall 516 and hidden heat exchanger top wall 517 enclose the space made by the frame wall extrusions 510, the lower bottom cover 550, the upper bottom cover 551, the lower floor 520 and upper floor 521. Contained within the spaces closed by the hidden heat exchanger bottom wall 516 and the hidden heat exchanger top wall 517, is the lower insulating foam 560 and the upper insulating foam 561, used to better insulate against heat loss. The frame (in this case with the pin connector embodiment) has pin hole 518, to allow for the pin hole stud 130.

[0061] To increase the efficiency of the heat pipe module and hidden heat exchanger assembly 700, reflective tape 530 can be used (see FIG. 8). The reflective tape 530 or any other suitable reflective material, attaches to the upper interior surface of the frame wall extrusions 510, and reflects the sun's energy back at the multiple heat pipe subassembly 200, contained within the frame subassembly 500.

[0062] To attach the frame subassembly 500, to the multiple heat pipe subassembly 200, multiple heat pipe risers 522 with multiple heat pipe fastener holes 524, are used. In this embodiment the multiple heat pipe risers 522 are located on top of the upper floor 521, two are near the hidden heat exchanger notch 515 and two are located by the bottom frame wall 513 (See FIG. 8).

[0063] The heat pipe module and hidden heat exchanger assembly 700 is connected to upper track 710 and lower track 720 using the mount plate 540 (See FIG. 9). Each mount plate 540 has a mount plate slide opening 541 that sets the limit of horizontal travel. This mount plate slide opening 541 is fixed into a set desired position by the mount plate fasteners 545, which bolt into the fastener nut plate 546 seen in FIG. 10. The mount plate groove 542 is the physical contact point of the tracks 710 and 720, and holds the mount plate 540 to the tracks 710 and 720. The adjustability of the mount plate slide opening 541 allows for the mount plate groove 542 to slide over the tracks 710 and 720. This way, the mount plates can accommodate the expansion and contraction of the frame subassembly 500 as the heat pipe module and heat exchanger assembly 700 passes through its warmer and cooler cycles.

[0064] The frame wall extrusion 510 has two details that allow for the panel subassembly 610 to slide and seal tightly against it. In the first detail, the panel subassembly 610 seen in FIGS. 5-7 slides over the top of the frame wall extrusion 510, wrapping tightly around the frame wall extrusion 510 and the panel bezel notch 503 (see FIGS. 9 and 10). In the second detail, the gasket notch 504 pockets the panel seal 506, seen in FIG. 11, that is attached to the panel bezels 611, 612, 613, and 614. This tight seal helps contain heat within heat pipe module and hidden heat exchanger assembly 700.

[0065] FIGS. 12-14 show views of heat transfer components 300. The heat transfer components 300 are comprised of the multiple heat pipe subassembly 200 connected to the heat exchanger subassembly 100 using (in this case with the pin connector embodiment) the pin hole stud 130. In FIG. 13, incident solar radiation (R) 270 is being collected by the multiple heat pipe subassembly 200, and transferred as heat flow (H) 160 to the heat exchanger subassembly 100. FIG. 14 shows the heat flow (H) 160 being transferred from the heat pipes 210 to the heat exchanger subassembly 100. Inside the heat exchanger subassembly 100 is space for the flowing heat transfer media (F) 150, which helps transport the heat flow (H) 160 to a desired purpose. The pin 170 can be seen in FIGS. 12-14 attaching the heat exchanger subassembly 100 to the multiple heat pipe subassembly 200. Shown in the detailed view of FIG. 13A is a preferred embodiment crimp 215 of a heat pipe 210 used to seal in the working fluid contained within the heat pipe 210. Preferably, when the heat pipe material is aluminum, the working fluid is acetone filled to about 10 - 50 percent of the heat pipe volume. Preferably, the acetone purity is as high as practically obtainable.

[0066] FIGS. 15-19A and 28-31 show different views of varying embodiments of the multiple heat pipe subassembly 200. The multiple heat pipe subassembly 200 transforms incident solar radiation (R) 270 into heat flow (H) 160. This transformation is accomplished by using the solar surface 225 of the absorber fin 220 to thermally absorb and conduct heat from the incoming solar radiation (R) 270. The heat flow (H) 160 being conducted by the absorber fin 220 is transferred to the heat pipe 210, which transfers the heat in a two-phase convective process from its evaporator region along its length to its condenser region, located near the heat transfer block 230. A preferred thermally conductive epoxy is used to connect the absorber fin 220 to the heat pipes 210. The preferred thermally conductive epoxy, may be substituted by welding or other suitable thermally conducting adhesive. Typically, the absorber fin 220 measures about 54 inches in length, about 7.5 inches in width, and about 0.375 inches in thickness.

[0067] To mount the multiple heat pipe subassembly 200 to the frame subassembly 500 (See FIG. 8), the slotted mounting holes 221 and the mounting holes 222 are used. The slotted mounting holes 221 are slotted to allow for thermal expansion of the multiple heat pipe

subassembly 200 along its length. An example of the mounting setup can be seen in FIG. 7. In the pin connector embodiment, multiple heat pipe fastener 224 connects the multiple heat pipe subassembly 200 to the frame subassembly 500 through the mounting holes 222 (See FIG. 16). To assist with the attachment of the heat exchanger subassembly 100 to the multiple heat pipe subassembly 200, a pin visual slot 223 is cut into the solar surface 225 and the absorber fin 220. This pin visual slot 223 allows the pin 170 to be visible for ease of assembly, and (in the stud connector embodiment, see FIG. 26) it also allows for the top threaded stud 140 to slide through and have fasteners compress the heat exchanger subassembly 100 against the multiple heat pipe subassembly 200.

[0068] Below the pin visual slot 223 is the location of the heat transfer block 230. The heat transfer block 230 is connected to the condenser region of the heat pipe 210 and the absorber fin 220 by a preferable thermally conductive epoxy. The heat transfer block 230 provides a structural piece between the heat exchanger subassembly 100 and the multiple heat pipe subassembly 200. The heat transfer block mount hole 236 allows for the passage of the pin hole stud 130 or the threaded stud 140 (See FIG. 26) for the fastening of the heat exchanger subassembly 100 to the multiple heat pipe subassembly 200. The heat transfer block 230 also provides a means of conducting heat flow (H) 160 from the condenser region of the heat pipe 210 through the heat transfer block profile 231, to the heat exchanger subassembly 100. Seen in the cross-section view of FIG. 19A, is the "V" 211 a thermally conductive insert.

[0069] FIGS. 20-24 are views of a heat exchanger subassembly 100. This heat exchanger subassembly 100 conducts heat flow (H) 160 from the heat transfer block 230 (See FIG. 14), and exchanges the heat flow (H) 160 primarily through conduction with the heat transfer media (F) 150 that may flow within its encompassing heat exchanger body 110. The heat exchanger body 110 of the heat exchanger subassembly 100 is composed of a top face 113, a left face 114, a right face 115, and a bottom face 116. The dimensions of the heat exchanger body 110 are typically about 17 inches long, about 6 inches wide, and about ½ inch thick. Within the heat exchanger body 110 are about eighteen top fins 111 that are used to increase the heat transfer surface area in contact with the flowing heat transfer media (F) 150. Also contained within the heat exchanger body 110 are five interior walls 112. These interior walls 112 also increase the heat transfer surface area for contact with the flowing heat transfer media (F) 150. Also, interior walls 112 provide a structural connection between the top face 113 and bottom face 116, allowing for higher-pressure conditions.

[0070] Attached to both ends of the heat exchanger body 110, by welds, epoxy, or other suitable attachment method, are flanges 120, which fit onto the heat exchanger body 110 with the mate receiving flange slot 122. The flange slot 122 is about 6 inches wide, and about ½ inch thick, to fit the heat exchanger body 110. On each flange 120 are about eight flange fastener holes 121 to be used with fasteners, typically bolts and nuts, to connect the heat exchanger subassembly 100 to either another heat exchanger subassembly 100 or to a plenum subassembly (See FIG. 25). Each plenum subassembly is comprised of two gaskets 420, a plenum 430, and a plenum cap 440. Heat transfer media (F) 150 may pass through the hidden heat exchanger assembly 400, entering through a plenum opening 431 on one side, and exiting through another plenum opening 431 on the other side of the hidden heat exchanger assembly 400. To fasten the heat exchanger subassembly 100 to the heat transfer block 230, and to the rest of the multiple heat pipe subassembly 200 (See FIG. 16), there are two mounting embodiments that are located on the top face 113. The first mounting option is a pin hole stud 130. This embodiment uses four of the pin hole studs 130, and four pins 170, connecting the heat exchanger subassembly 100 to the heat transfer block 230, and the multiple heat pipe subassembly 200. The pin hole 131, seen in FIG. 20, allows for the pin 170 to pass through the pin hole stud 130. To promote a higher efficiency of heat transfer, thermal paste 235 (See FIGS. 20, 21 and 25), is used to fill in voids between the heat transfer block bottom surface 234 and the top face 113 of the preferably extruded heat exchanger subassembly 100. To prevent unwanted heat loss from occurring through the bottom face 116, a hidden heat exchanger insulator 410 is attached. This attachment is done by sliding the hidden heat exchanger insulator 410 over the bottom threaded stud 145 located at the center of the bottom face 116.

[0071] FIGS. 26-33 represent varying components of the heat pipe module and heat exchanger assembly 700 with the second, threaded stud 140 mounting embodiment. The second mounting option is a top threaded stud 140, this embodiment uses four of the top threaded studs 140, four washers 141, four nuts 142, and four heat transfer block spacers 237 (See FIG. 27) to attach the heat exchanger subassembly 100 to the multiple heat pipe subassembly 200. When using the top threaded stud 140 mounting option, a heat transfer block spacer 237 is used to fill the gap between the absorber fin 220 and the heat transfer block 230. The heat transfer block spacer 237 allows for the safe compression of the multiple heat pipe subassembly 200 against the top face 113 of the heat exchanger subassembly 100. In the multiple heat pipe subassembly 200 stud connection embodiment seen in FIG. 29, it can be seen that the pin visual slot 223 is much narrower than in the pin connection embodiment seen in FIG. 17. FIG.32 shows the hidden heat exchanger assembly 400 with the top threaded studs 140 located on top, as an alternate embodiment to the pin hole stud 130. The exploded view of the heat transfer components 300 seen in FIG. 33 illustrates the alternate parts needed for a top threaded stud 140 connection rather than a pin hole stud 130 connection. Alternate or additional parts needed for the top threaded stud 140 connection are the heat transfer block spacers 237, washers 141 and nuts 142. [0072] Although this invention has been described above with reference to particular means, materials and embodiments, it is to be understood that the invention is not limited to these disclosed particulars, but extends instead to all equivalents within the scope of the following claims. Having thus described the invention, what is desired to be protected by Letters Patent is presented in the appended claims. All of the language of the appended claims-as-filed is herein incorporated into this Description by this reference.