Title:
MODULAR VIBRATION-REDUCTION PC SLAB
Document Type and Number:
WIPO Patent Application WO/2021/157955
Kind Code:
A1
Abstract:
The present invention relates to a modular, vibration-reduction PC slab, in which a plurality of box-type and hollow PC modules are coupled to each other in a width direction to reduce vibration in semiconductor or display manufacturing factories and the like and also minimize the field work to thereby shorten the duration of production. The modular vibration-reduction PC slab according to the present invention consists of a plurality of box-type and hollow PC modules coupled to each other in a width direction, wherein each of the PC modules consists of an upper plate, a lower plate, and a pair of lateral plates connecting respective two ends of the upper and lower plates and has a quadrangular cross-section.
Inventors:
KANG THOMAS HYUN KOO (KR)
KIM KEUN SAM (KR)
KIM KEUN SAM (KR)
Application Number:
PCT/KR2021/001146
Publication Date:
August 12, 2021
Filing Date:
January 28, 2021
Export Citation:
Assignee:
SEOUL NAT UNIV R&DB FOUNDATION (KR)
EURO ENG CO LTD (KR)
EURO ENG CO LTD (KR)
International Classes:
E04B5/04; E04B1/04; E04B1/06; E04B5/02; E04B5/08
Foreign References:
| KR100681849B1 | 2007-02-15 | |||
| KR20160030695A | 2016-03-21 | |||
| KR101713632B1 | 2017-03-08 | |||
| JP2000320023A | 2000-11-21 | |||
| CN106555453A | 2017-04-05 |
Attorney, Agent or Firm:
KIM, Locbae (KR)
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