Title:
MODULE COMPONENT, ANTENNA MODULE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/218289
Kind Code:
A1
Abstract:
A module component according to the present invention has: a substrate having a first principal surface; a semiconductor substrate provided on the first principal surface of the substrate; a plurality of terminals; and a resin layer. The plurality of terminals include: a plurality of reference potential terminals electrically connected to a reference potential; and a plurality of signal terminals that are disposed adjacent to at least one of the plurality of reference potential terminals in a direction along an end section of the substrate and that are supplied with signals. In plan view in a direction orthogonal to the first principal surface of the substrate, a support section is disposed between an end surface of a connecting section and the end section of the substrate at at least one of the plurality of reference potential terminals. In plan view, the end surface of the connecting section is disposed between the support section and the end section of the substrate at at least one of the plurality of signal terminals.
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Inventors:
ARIUMI SANEAKI (JP)
Application Number:
PCT/JP2020/017180
Publication Date:
October 29, 2020
Filing Date:
April 21, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/00; H01Q23/00
Domestic Patent References:
| WO2018168653A1 | 2018-09-20 | |||
| WO2007132612A1 | 2007-11-22 |
Foreign References:
| JP2006190767A | 2006-07-20 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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