Title:
MODULE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/199617
Kind Code:
A1
Abstract:
This module component (1) is provided with: a substrate (10); a first main electrode (40a) that is arranged on a main surface of the substrate (10); a second main electrode (40b); a third main electrode (40c); a fourth main electrode (40d); a sub electrode (50) that is arranged between two main electrodes and is connected to one of the first main electrode (40a), the second main electrode (40b), the third main electrode (40c) and the fourth main electrode (40d) by means of a solder (60a); a first mounting component (20a) that is mounted on the first main electrode (40a) and the second main electrode (40b); and a second mounting component (20b) that is mounted on the third main electrode (40c) and the fourth main electrode (40d). The area of the sub electrode (50) is smaller than the areas of the main electrodes (40a-40d).
Inventors:
NISHIKAWA HIROSHI (JP)
Application Number:
PCT/JP2017/014160
Publication Date:
November 23, 2017
Filing Date:
April 04, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/11; H05K1/18; H05K3/22; H05K3/34
Foreign References:
| JP2010267903A | 2010-11-25 | |||
| JP2001144395A | 2001-05-25 | |||
| JPS58121662A | 1983-07-20 | |||
| JP2006156512A | 2006-06-15 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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