MODULE COMPONENT

WIPO Patent Application WO/2018/110215

A1

This module component (10) is provided with: a multilayer substrate (20) that comprises a magnetic layer (21); mount-type electronic components (51, 52); and an outer surface conductor (60). The multilayer substrate (20) comprises a first main surface (203) and a second main surface (204), which are opposite to each other, and lateral surfaces (201, 202) which are connected to the first main surface (203) and the second main surface (204); and the second main surface (204) is provided with terminal conductors (411, 412) for grounding. The mount-type electronic components (51, 52) are mounted on land conductors (441, 442) for component mounting. The outer surface conductor (60) covers the first main surface (203) and the lateral surfaces (201, 202) of the multilayer substrate (20). The multilayer substrate (20) is provided with the magnetic layer (21), a ground path (SL) for low frequency use, and a ground path (SH) for high frequency use, while connecting the outer surface conductor (60) and the terminal conductors (411, 412) for grounding to each other. The ground path (SL) for low frequency use connects the outer surface conductor (60), a first ground layer (430) that is arranged on the first main surface (203) side of the magnetic layer (21), and a first via conductor (450) that penetrates the magnetic layer (21) in the thickness direction to each other.

KOBAYASHI NORIFUMI (JP)

PCT/JP2017/041736

June 21, 2018

November 21, 2017

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MURATA MANUFACTURING CO (JP)

H05K3/46; H01F17/00; H01L23/12; H05K1/02; H05K9/00

WO2010016367A1

2010-02-11

US20140016293A1	2014-01-16
JP2005217078A	2005-08-11
JP2013026330A	2013-02-04

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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