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Patent Searching and Data


Title:
MODULE CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2017/082080
Kind Code:
A1
Abstract:
Provided is a module connector such that size reduction, fitness improvement, and cost reduction can be made possible by improving the connection method between a terminal fitted in a module upper case and a module substrate mounted in a module lower case. The module connector comprises: a plurality of case-side contact terminals (1012); and a plurality of contact-meeting pads (1023) provided on the module substrate (1022) fixed in a module-side case (1021). Each of the case-side contact terminals (1012) comprises: a connector contact portion (1012a) brought into contact at connector mating time with each of a plurality of cable-side contact terminals 112 connected to a multi-conductor cable 10; a spring portion (1012b) having spring properties; and a substrate connection portion (1012c) fixed onto the module substrate (1022). Each of the case-side contact terminals (1012) is formed as a single body in such a manner that the spring portion (1012b) is disposed between the connector contact portion (1012a) and the substrate connection portion (1012c).

Inventors:
SASAKI TAKAMITSU (JP)
OYA MASAAKI (JP)
Application Number:
PCT/JP2016/082039
Publication Date:
May 18, 2017
Filing Date:
October 28, 2016
Export Citation:
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Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H01R12/55; H01R13/08
Foreign References:
JP2012169158A2012-09-06
JP2012204312A2012-10-22
JPS54167392U1979-11-26
JP5573928B22014-08-20
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