MODULE FOR IC CARD, IC CARD, AND METHOD FOR MANUFACTURING MODULE FOR IC CARD

Title:

MODULE FOR IC CARD, IC CARD, AND METHOD FOR MANUFACTURING MODULE FOR IC CARD

Document Type and Number:

WIPO Patent Application WO/1998/059317

Kind Code:

A1

Abstract:

A module for IC card (A) incorporated in an IC card (B) has a board (1), an IC chip (2) mounted on the board (1), and a protecting member (4) joined to the board (1) so as to cover the IC chip (2). Since a space (S) is provided between the protecting member (4) and the IC chip (2), the protecting member (4) and the IC chip (2) are prevented from coming into direct contact with each other. In the space (S), a filler (6) having a small modulus of elasticity is filled in accordance with the necessity. The protecting member (4) is provided with a reinforcing member (8).

Inventors:

HIRAI MINORU (JP)
UEDA SHIGEYUKI (JP)
MIYATA OSAMU (JP)
HORIO TOMOHARU (JP)

Application Number:

PCT/JP1998/002832

Publication Date:

December 30, 1998

Filing Date:

June 23, 1998

Export Citation:

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Assignee:

ROHM CO LTD (JP)
HIRAI MINORU (JP)
UEDA SHIGEYUKI (JP)
MIYATA OSAMU (JP)
HORIO TOMOHARU (JP)

International Classes:

G06K19/077; H01Q1/22; H01Q7/00; (IPC1-7): G06K19/00; B42D15/10

Foreign References:

JPS6378796A	1988-04-08
JPS6337998A	1988-02-18

Other References: