Title:
MODULE, MODULE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/203923
Kind Code:
A1
Abstract:
The present invention suppresses, compared with conventional cases, a temperature increase of a module in which an image sensor is mounted and fixed on a substrate, and delays, compared with the conventional cases, time when the temperature of the module reaches a predetermined temperature, thereby making longer the available time of the module compared with the conventional cases.
This module is provided with: an organic substrate; an image sensor placed on the upper surface of the organic substrate; a wire that connects the image sensor and the organic substrate to each other; and a wire sealing section adhered to the side surface of the image sensor, while having the wire therein. The heat conductivity of the wire sealing section is higher than that of the organic substrate.
Inventors:
OTANI HIDETSUGU (JP)
KISHIGAMI YUUJI (JP)
KISHIGAMI YUUJI (JP)
Application Number:
PCT/JP2016/065514
Publication Date:
December 22, 2016
Filing Date:
May 25, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; G02B7/02; H04N5/369
Foreign References:
| JP2012124305A | 2012-06-28 | |||
| JP2010212481A | 2010-09-24 | |||
| CN104716149A | 2015-06-17 | |||
| JP2009188191A | 2009-08-20 | |||
| JP2013243341A | 2013-12-05 | |||
| JP2007158779A | 2007-06-21 | |||
| JP2014138119A | 2014-07-28 | |||
| US20050170561A1 | 2005-08-04 |
Attorney, Agent or Firm:
MATSUO KENICHIRO (JP)
Ken-ichiro Matsuo (JP)
Ken-ichiro Matsuo (JP)
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