Title:
MODULE AND MODULE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/013831
Kind Code:
A1
Abstract:
Provided is a feature in which the profile of a module can be made lower without impairing handleability. A single surface is formed from the upper surface of a branching filter (10) mounted on a mounting surface (2a) of a module substrate (2) and the upper surface of a resin layer (7) provided on the mounting surface (2a) so as to cover the lateral faces of the branching filter (10). Therefore, although the thickness of the resin layer (7) is reduced by the thickness of the branching filter (10), the single surface formed by the upper surface of the branching filter (10) and resin layer (7) is subjected to sucking, holding, and the like, and thus a module (1) can be transferred by a transfer device (illustration omitted) having a suction mechanism. As a result, the profile of the module (1) can be made lower without impairing handleability.
Inventors:
YAMATO SYUJI (JP)
KITAJIMA HIROMICHI (JP)
KITAJIMA HIROMICHI (JP)
Application Number:
PCT/JP2013/066788
Publication Date:
January 23, 2014
Filing Date:
June 19, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H3/08; H03H9/72
Domestic Patent References:
| WO2007114224A1 | 2007-10-11 |
Foreign References:
| JP2001332654A | 2001-11-30 | |||
| JP2004129088A | 2004-04-22 | |||
| JP2007157891A | 2007-06-21 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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