Title:
MODULE, TERMINAL ASSEMBLY, AND METHOD FOR PRODUCING MODULE
Document Type and Number:
WIPO Patent Application WO/2020/202841
Kind Code:
A1
Abstract:
Provided are: a module in which adhesion between a connecting conductor and a sealing resin is improved and the connecting conductor is inhibited from disengaging from the sealing resin; a terminal assembly; and a method for producing the module. The module is provided with a circuit board, an electronic component mounted to a main surface on one side of the circuit board, a connecting conductor mounted to the main surface on the one side of the circuit board, and a sealing resin provided to the main surface on the one side of the circuit board so as to cover the electronic component and the connecting conductor. The connecting conductor comprises a plate-like conductor provided upright on the main surface on the one side of the circuit board and a plurality of terminal sections that are adjacent to each other and that extend from the plate-like conductor in a direction leading away from the main surface on the one side of the circuit board. The tips of the plurality of terminal sections are exposed from the sealing resin.
Inventors:
OKAMOTO KAZUYA (JP)
HAGA TAKASHI (JP)
TAKAGI MASAYOSHI (JP)
SATO KAZUSHIGE (JP)
HAGA TAKASHI (JP)
TAKAGI MASAYOSHI (JP)
SATO KAZUSHIGE (JP)
Application Number:
PCT/JP2020/006034
Publication Date:
October 08, 2020
Filing Date:
February 17, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/28; H01L25/04; H01L25/065; H01L25/07; H01L25/18; H01R43/00
Domestic Patent References:
| WO2013035716A1 | 2013-03-14 | |||
| WO2019138895A1 | 2019-07-18 |
Foreign References:
| JP2012015216A | 2012-01-19 | |||
| US20120139089A1 | 2012-06-07 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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