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Patent Searching and Data


Title:
MODULE-TERMINAL BLOCK CONNECTION STRUCTURE AND CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/098475
Kind Code:
A1
Abstract:
A module-terminal block connection structure of the present invention is provided with: a printed wiring board; a terminal block which is arranged on one surface (front surface) of the printed wiring board, which is formed to a three-dimensional shape from a conductive material, and which is fixed to the printed wiring board; a power module arranged on the other surface (back surface) of the printed wiring board, and having an electrical circuit and lead pins of a press-fit type serving as circuit terminals of the electrical circuit; and a conductive part which is electrically connected to the terminal block, which has holes (through-holes) into which the lead pins are pressure-fit, and which becomes electrically connected to the power module in a state where the lead pins have been pressure-fit into the holes.

Inventors:
KOTERA KEITO
DOI HIROTAKA
HIRAOKA NOBUYASU
DOUMAE HIROSHI
TAKEZOE MICHIYA
KOYAMA TAKUJI
Application Number:
JP2015/081025
Publication Date:
June 23, 2016
Filing Date:
November 04, 2015
Export Citation:
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Assignee:
DAIKIN IND LTD (?5308323, JP)
International Classes:
H01R9/22; H01R12/51; H05K1/18
Foreign References:
JPH06302932A1994-10-28
JPS5825051U1983-02-17
JPH02137052U1990-11-15
Other References:
See also references of EP 3236533A4
Attorney, Agent or Firm:
SunCrest Patent and Trademark Attorneys (?6500023, JP)
Patent business corporation Sun Crest international patent firm (?6500023, JP)
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