Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2018/159453
Kind Code:
A1
Abstract:
Provided is a module having excellent heat dissipation characteristics and in which the height can be easily reduced. The module 1a comprises: a wiring substrate 2; a plurality of components 3a-3c mounted on the upper surface 2a of the wiring substrate 2; a plurality of heat dissipation members 4a-4c; a sealing resin layer 5 laminated on the upper surface 2a of the wiring substrate 2; and a shield film 6 covering the surface of the sealing resin layer 5. Each of the heat dissipation members 4a-4c is formed as a sheet in which the surface is shaped as a strip. Both end sections of the heat dissipation member 4a are in contact with the upper surface 2a of the wiring substrate 2, and are in contact with components 3a and 3b disposed between the two end sections. The heat dissipation member 4a forms a heat dissipation path through which the heat given off by the component 3a is dissipated to the wiring substrate 2.
Inventors:
FUJII AKIHIRO (JP)
KOMATSU TORU (JP)
KOMATSU TORU (JP)
Application Number:
PCT/JP2018/006468
Publication Date:
September 07, 2018
Filing Date:
February 22, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/00; H01L23/28; H01L25/04; H01L25/18; H05K7/20; H05K9/00
Foreign References:
| US20030179549A1 | 2003-09-25 | |||
| CN101221944A | 2008-07-16 | |||
| JP2008034778A | 2008-02-14 | |||
| US20080258294A1 | 2008-10-23 | |||
| JPH04368155A | 1992-12-21 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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