Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2018/164159
Kind Code:
A1
Abstract:
The present invention improves electrical connectivity between a shield layer and an electrode formed on a wiring substrate. A module 1 comprises: a wiring substrate 2; a component 3 mounted on one main surface of the wiring substrate 2; a metal pin 4 that has one end surface 4a attached to a land electrode 7b formed in the one main surface 2a, and that includes a first extending part 15 extending from the one end surface 4a so as to go away from the one main surface 2a, a second extending part 16 bending and extending from a side opposite the one end surface 4a, and a third extending part 17 bending from a side of the second extending part 16 opposite the first extending part 15 and extending so as to approach the one main surface 2a; a sealing resin layer 5 covering the one main surface 2a and component 3, and covering the metal pin 4 except for a pin upper surface 4c and a pin side outer surface 4d; and a shield layer 6 respectively covering and contacting the side surfaces of the wiring substrate 2, the surface of the sealing resin layer 5, and the pin upper surface 4c and pin side outer surface 4d of the metal pin 4.
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Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2018/008681
Publication Date:
September 13, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| WO2008093414A1 | 2008-08-07 |
Foreign References:
| JP2011529638A | 2011-12-08 | |||
| JP2003249607A | 2003-09-05 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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