Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2019/111874
Kind Code:
A1
Abstract:
Provided is a module that is of a package-on-package structure and that has a rewiring layer so as to be easily reduced in height. A module 1 has: an upper module 16 that includes a substrate 2, a first component 3, and a sealing resin layer 4; and a lower module 17 that includes an intermediate layer 5 and a rewiring layer 6. The first component 3 is connected to the rewiring layer 6 via a columnar conductor 8 that is provided to the intermediate layer 5, and the first component 3 and a second component 7 are both rewired by the rewiring layer 6. Positional displacement of the second component 7 can be prevented by fixing a resin block 8, which includes the second component 7, to a lower surface 2b of the substrate 2 through a fixing conductor 11. Flatness can be improved by polishing the upper surface 8a of the resin block 8.
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Inventors:
OTSUBO YOSHIHITO (JP)
YAMAMOTO YUKIO (JP)
YAMAMOTO YUKIO (JP)
Application Number:
PCT/JP2018/044499
Publication Date:
June 13, 2019
Filing Date:
December 04, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/10; H01L25/11; H01L25/18; H05K1/18; H05K3/28; H05K3/46
Foreign References:
| JP2016213466A | 2016-12-15 | |||
| US20110068481A1 | 2011-03-24 | |||
| US9793246B1 | 2017-10-17 | |||
| JP2012023237A | 2012-02-02 | |||
| JP2015523743A | 2015-08-13 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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