Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2020/153331
Kind Code:
A1
Abstract:
This module (101) is provided with: a substrate (1) having a first main surface (1a); a columnar conductor (7) arranged on the first main surface (1a); a first sealing resin (6a) that seals at least the columnar conductor (7) and the first main surface (1a) by making a first end surface (7a) of the columnar conductor (7) exposed; a conductive film (12) connected to the columnar conductor (7) and arranged to laterally bulge out from the first end surface (7a); a resin sheet (13) arranged so as to cover at least the conductive film (12); a conductive via (14) provided to the resin sheet (13) and connected to the conductive film (12) via one end (14a); and a conductor pattern (15) that is arranged on a side, far from the substrate (1), on the resin sheet (13) so as to be connected to the other end (14b) of the conductor via (14) and that has a larger area than the first end surface (7a).
Inventors:
TAKAKURA TSUYOSHI (JP)
KUSUYAMA TAKAFUMI (JP)
KUSUYAMA TAKAFUMI (JP)
Application Number:
PCT/JP2020/001859
Publication Date:
July 30, 2020
Filing Date:
January 21, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K3/28; H05K3/46
Domestic Patent References:
| WO2013121732A1 | 2013-08-22 | |||
| WO2018150724A1 | 2018-08-23 | |||
| WO2005071745A1 | 2005-08-04 |
Foreign References:
| JP2017050310A | 2017-03-09 | |||
| JP2012028487A | 2012-02-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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