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Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2020/196522
Kind Code:
A1
Abstract:
In the present invention, a substrate (110) has a main surface (111), and each of one or more inductors (120) is disposed on the main surface (111). A resin sealing section (130) seals the one or more inductors (120) and covers the main surface (111) of the substrate (110). In plan view, a ground conductor section (140) is disposed on the outer peripheral side of the substrate (110) with respect to the entirety of the one or more inductors (120). A plurality of linear conductor sections (150) are formed on the resin sealing section (130). In plan view, the plurality of linear conductor sections (150) are disposed with gaps (151) between each other so that the one or more inductors (120) overlap with at least one of the plurality of linear conductor sections (150).

Inventors:
KITAZUME TAKAHIRO (JP)
MIYAZAKI DAISUKE (JP)
Application Number:
JP2020/013022
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01F27/32; H01F27/36; H01L23/28; H01L25/00
Domestic Patent References:
WO2017122416A12017-07-20
Foreign References:
JP2006005297A2006-01-05
JPH05299962A1993-11-12
JP2017174920A2017-09-28
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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