Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/241325
Kind Code:
A1
Abstract:
A module 500 is used in a semiconductor composite device 10 that supplies, to a load 300, a direct-current voltage adjusted by a voltage regulator 100 which includes a semiconductor active element. The module 500 comprises: a capacitor layer 210 including at least one capacitor part 230 which forms a capacitor CP1; a connection terminal that is used in an electrical connection with at least one of the voltage regulator 100 and the load 300; and a through-hole conductor 262 that is formed so as to penetrate through the capacitor part 230 in the thickness direction of the capacitor layer 210. The capacitor CP1 is electrically connected via the through-hole conductor 262 to at least one of the load 300 and the voltage regulator 100.
Inventors:
OTANI SHINJI (JP)
TAKAHASHI AKITOMO (JP)
SAKAI TAKAAKI (JP)
FURUKAWA TAKESHI (JP)
KITAMURA TATSUYA (JP)
TAKAHASHI AKITOMO (JP)
SAKAI TAKAAKI (JP)
FURUKAWA TAKESHI (JP)
KITAMURA TATSUYA (JP)
Application Number:
PCT/JP2021/018772
Publication Date:
December 02, 2021
Filing Date:
May 18, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G9/15; G05F1/56; H01G9/012; H01L23/12; H01L25/07; H01L25/18; H02M3/00; H05K1/11; H05K1/16
Domestic Patent References:
| WO2019130746A1 | 2019-07-04 |
Foreign References:
| JP2007173439A | 2007-07-05 | |||
| JP2005183548A | 2005-07-07 | |||
| US20110050334A1 | 2011-03-03 | |||
| JP2004281750A | 2004-10-07 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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