Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/251219
Kind Code:
A1
Abstract:
A module (101) comprises: a substrate (1) having a first surface (1a); a first component (41) mounted on the first surface (1a); a resin film (21) covering the first component (41) along the shape of the first component (41) and also covering a part of the first surface (1a); and one or more wires (5) disposed over the first component (41) on a side of the resin film (21) farther from the substrate (1).
More Like This:
| JPS564250 | CONTAINER |
Inventors:
OTSUBO YOSHIHITO (JP)
KUSUYAMA TAKAFUMI (JP)
KUSUYAMA TAKAFUMI (JP)
Application Number:
PCT/JP2021/020867
Publication Date:
December 16, 2021
Filing Date:
June 01, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/29; H01L23/31; H01L25/04; H01L25/18; H05K9/00
Domestic Patent References:
| WO2019156051A1 | 2019-08-15 |
Foreign References:
| JP2002334954A | 2002-11-22 | |||
| JP2010177520A | 2010-08-12 | |||
| JP2017084898A | 2017-05-18 | |||
| JPH04154133A | 1992-05-27 | |||
| JP2000031195A | 2000-01-28 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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