Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2023/089988
Kind Code:
A1
Abstract:
This module (101) comprises a first electronic component (31) having a first component surface (61) and a second component surface (62), a second electronic component (32) having a third component surface (63) and a fourth component surface (64), a first substrate (51) having a first substrate surface (71) and a second substrate surface (72), and a second substrate (52) having a third substrate surface (73) and a fourth substrate surface (74), the second substrate (52) being positioned so as to overlap the first substrate (51) while being separated from the first substrate (51), the first electronic component (31) and the second electronic component (32) being positioned such that the second component surface (62) and the third component surface (63) face each other, at least a part of the second electronic component (32) being positioned in the interior of an opening (10), the first electronic component (31) being mounted on the second substrate surface (72) through face-bonding, and the second electronic component (32) being wire-bonded to the fourth substrate surface (74) using a second connection terminal (82).
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2022/037826
Publication Date:
May 25, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/07; H01L25/00; H01L25/065; H01L25/18; H05K1/14; H05K3/46
Foreign References:
| JP2008159956A | 2008-07-10 | |||
| JPH11297927A | 1999-10-29 | |||
| JP2006165333A | 2006-06-22 | |||
| JP2020108069A | 2020-07-09 | |||
| JP2016511552A | 2016-04-14 | |||
| JP2016082156A | 2016-05-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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