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Title:
Moisture Curable Hot-melt Adhesive Composition
Document Type and Number:
WIPO Patent Application WO/2019/109328
Kind Code:
A1
Abstract:
Disclosed is a moisture curable hot-melt adhesive composition, comprising a silane modified polymer, a ethylenically unsaturated carboxylic acid graft modified polymer, and a tackifying agent. The moisture curable hot-melt adhesive composition provides a cured product exhibiting improved bonding strength and excellent reworkability at room temperature.

Inventors:
XING, Wentao (29-602, No.225 Xinsong Rd Minhang District, Shanghai, CN)
GUO, Hui (10-301, No.4058 Chuanzhou Rd, Shanghai, CN)
LOW, Yew-Guan (1901 Mingyue Road, Pudong, Shanghai, CN)
QIU, Xueyu (76-201, Lane 207 Xindexi Rd, Pudong, Shanghai, CN)
Application Number:
CN2017/115195
Publication Date:
June 13, 2019
Filing Date:
December 08, 2017
Export Citation:
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Assignee:
HENKEL AG & CO. KGAA (Henkelstr. 67, Duesseldorf, Duesseldorf, DE)
HENKEL (CHINA) CO., LTD. (No.189 Guo Yuan Road, Zhu Qiao Town Pu Dong New Area, Shanghai 4, 201324, CN)
International Classes:
C09J201/10; C09J143/04; C09J151/06; C09J171/02; C09J175/00
Domestic Patent References:
WO1996010615A11996-04-11
Foreign References:
US20140027056A12014-01-30
CN104981527A2015-10-14
US6121354A2000-09-19
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (10th Floor, Tower C Beijing Global Trade Center,36 North Third Ring Road East, Dongcheng District, Beijing 3, 100013, CN)
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