MOISTURE-CURABLE COMPOSITION AND METHOD OF BONDING

WIPO Patent Application WO/2005/087865

A1

A moisture-curable composition having excellent performance required of the adhesives or fixatives for use in assembling electrical or precision appliances for which flame retardancy is required. The composition comprises as essential ingredients (A) at least one polymer selected from the group consisting of a polyurethane polymer having a reactive group crosslinkable by hydrolysis, a (meth)acrylic polymer having a reactive group crosslinkable by hydrolysis, a silicone having a reactive group crosslinkable by hydrolysis, and a polyoxyalkylene polymer having a reactive group crosslinkable by hydrolysis, (B) a metal hydroxide having an average particle diameter of 0.1 to 200 µm, and (C) surface-treated calcium carbonate having an average particle diameter of 0.01 to 10 µm.

KUROSAWA SHIGERU (JP)
OSHIMA YUICHI (JP)
KISHIMOTO MASAAKI (JP)
HORIE YASUNOBU (JP)

PCT/JP2004/003289

September 22, 2005

March 12, 2004

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CEMEDINE CO LTD (JP)
KUROSAWA SHIGERU (JP)
OSHIMA YUICHI (JP)
KISHIMOTO MASAAKI (JP)
HORIE YASUNOBU (JP)

C08L33/06; C08L75/04; C08L83/06; C09J11/04; C09J133/10; C09J171/02; C09J175/04; C09J183/04; C09J183/06; C09J201/00; C08K3/22; C08K9/04; C08L71/02; C08L83/00; (IPC1-7): C08L33/06; C08L71/02; C08L75/04; C08L83/06; C09J11/04; C09J201/00

JPH11310682A	1999-11-09
JP2001002746A	2001-01-09
JPH11209620A	1999-08-03
JPS50156599A	1975-12-17
JP2003226854A	2003-08-15
JP2003313397A	2003-11-06
JP2004059851A	2004-02-26

Ishihara, Shoji (Wakai Bldg. 7-8, Higashi-Ikebukuro 3-chom, Toshima-ku Tokyo 13, JP)

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