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Title:
MOISTURE-CURABLE HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2017/110794
Kind Code:
A1
Abstract:
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa・s or less at a temperature of 170oC and (C) a polyester-polyether copolymer.

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Inventors:
MATSUDA KENJI (JP)
TAKAMORI AI (JP)
TAMOGAMI TSUYOSHI (JP)
Application Number:
PCT/JP2016/087917
Publication Date:
June 29, 2017
Filing Date:
December 20, 2016
Export Citation:
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Assignee:
HENKEL JAPAN LTD (JP)
International Classes:
C09J175/04; C09J123/00; C09J123/08; C09J125/16; C09J173/00
Domestic Patent References:
WO2012154940A12012-11-15
WO1991015530A11991-10-17
WO2001081495A22001-11-01
Foreign References:
JP2004010809A2004-01-15
JPH02305881A1990-12-19
JPH048786A1992-01-13
EP0232055A21987-08-12
JP2015254365A2015-12-25
JP3022924B22000-03-21
JP2014518916A2014-08-07
JP2004010809A2004-01-15
Other References:
See also references of EP 3394198A4
Attorney, Agent or Firm:
ITO Katsuhiro et al. (JP)
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