Title:
MOISTURE-CURABLE POLYURETHANE HOT MELT RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/163622
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a moisture-curable polyurethane hot melt resin composition with excellent initial adhesive strength and which can form a cured film with excellent flexibility. A moisture-curable polyurethane hot melt resin composition is provided which is characterized in that the storage modulus (G') of the melt viscoelasticity at 20°C prior to curing is greater than or equal to 0.1 MPa, and the Young's modulus of the cured film is less than or equal to 20 MPa. This moisture-curable polyurethane hot melt resin composition contains a urethane prepolymer (i) with an isocyanate group having polyols (A) and polyisocyanate (B) as raw materials, and it is preferable to use less than 10 mass% crystalline polyester polyols out of the total mass of the polyols (A) and the polyisocyanate (B).
Inventors:
NINOMIYA ATSUSHI (JP)
FUJIWARA TOYOKUNI (JP)
FUJIWARA TOYOKUNI (JP)
Application Number:
PCT/JP2019/005250
Publication Date:
August 29, 2019
Filing Date:
February 14, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G18/30; C08G18/10; C08G18/40
Foreign References:
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| JPH02163186A | 1990-06-22 | |||
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| JPH11323302A | 1999-11-26 | |||
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| JP2009535465A | 2009-10-01 | |||
| JP2005206828A | 2005-08-04 | |||
| JP2011518239A | 2011-06-23 | |||
| JP2013501828A | 2013-01-17 | |||
| JP2015063579A | 2015-04-09 | |||
| JP2016121213A | 2016-07-07 | |||
| JP2016204541A | 2016-12-08 | |||
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| US6133400A | 2000-10-17 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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