Title:
MOISTURE-CURABLE POLYURETHANE HOT-MELT RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/025093
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a moisture-curable polyurethane hot-melt resin composition having excellent low-viscosity, initial adhesive strength, flexibility, coating suitability, and hydrolysis resistance. The present invention provides a moisture-curable polyurethane hot-melt resin composition characterized by containing a urethane prepolymer (i) which is made from a polyol (A) and a polyisocyanate (B) and has an isocyanate group, wherein the polyol (A) contains a polyester polyol (a1) made from adipic acid, a polyether polyol (a2), and an aromatic polyester polyol (a3), and the total used amount of the polyester polyol (a1) and the polyether polyol (a2) is larger than the used amount of the aromatic polyester polyol (a3).
Inventors:
NINOMIYA ATSUSHI (JP)
FUJIWARA TOYOKUNI (JP)
HIGESHIRO TOMOKAZU (JP)
FUJIWARA TOYOKUNI (JP)
HIGESHIRO TOMOKAZU (JP)
Application Number:
PCT/JP2020/030108
Publication Date:
February 11, 2021
Filing Date:
August 06, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G18/12; C09J175/04; C08G18/30; C08G18/40; C08G18/42; C08G18/48
Domestic Patent References:
| WO2009011177A1 | 2009-01-22 |
Foreign References:
| JP2005133051A | 2005-05-26 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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