Title:
MOISTURE-CURABLE RESIN COMPOSITION AND ASSEMBLED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/087743
Kind Code:
A1
Abstract:
[Problem] To provide a moisture-curable resin composition which highly rapidly cures with moisture and to provide an assembled component including a cured object obtained from the moisture-curable resin composition.
[Solution] A moisture-curable resin composition containing a moisture-curable urethane resin. The moisture-curable resin composition comprises: an alkoxysilyl-containing moisture-curable urethane resin and/or an alkoxysilyl-containing compound that is not a moisture-curable urethane resin; a moisture-curing acceleration catalyst; and a silanol condensation catalyst.
Inventors:
KIDA TAKUMI (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
TAMAGAWA TOMOKAZU (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
TAMAGAWA TOMOKAZU (JP)
Application Number:
PCT/IB2017/057117
Publication Date:
May 17, 2018
Filing Date:
November 14, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G18/30; C08G18/10; C08G18/18; C09J4/00; C09J4/06; C09J11/06; C09J175/04
Domestic Patent References:
| WO2016045927A1 | 2016-03-31 | |||
| WO2016006501A1 | 2016-01-14 | |||
| WO2001053423A1 | 2001-07-26 | |||
| WO2015190499A1 | 2015-12-17 | |||
| WO2015174371A1 | 2015-11-19 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: