Title:
MOISTURE-CURING REACTIVE HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/152002
Kind Code:
A1
Abstract:
Provided is a curable composition that uses a polymer having reactive silicon groups of low toxicity, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high temperatures and curability at room temperature. The moisture-curing reactive hot melt adhesive composition either comprises(A1) an organic polymer containing reactive silicon groups having two hydrolysable groups and, as the curing catalyst, (B1) a carboxylic acid metal salt and/or carboxylic acid, or (A2) an organic polymer containing reactive silicon groups having three hydrolysable groups and, as the curing catalyst, (B2) a tetravalent tin compound.
Inventors:
FUJIMOTO TOYOHISA (JP)
OKAMOTO TOSHIKIKO (JP)
OKAMOTO TOSHIKIKO (JP)
Application Number:
PCT/JP2011/002939
Publication Date:
December 08, 2011
Filing Date:
May 26, 2011
Export Citation:
Assignee:
KANEKA CORP (JP)
FUJIMOTO TOYOHISA (JP)
OKAMOTO TOSHIKIKO (JP)
FUJIMOTO TOYOHISA (JP)
OKAMOTO TOSHIKIKO (JP)
International Classes:
C09J201/10; C09J11/06; C09J133/06; C09J171/02
Domestic Patent References:
| WO2010035821A1 | 2010-04-01 |
Foreign References:
| JP2010229199A | 2010-10-14 | |||
| JP2011001464A | 2011-01-06 | |||
| JP2009024107A | 2009-02-05 | |||
| JPH04502023A | 1992-04-09 | |||
| JPH08151562A | 1996-06-11 | |||
| JPH06271834A | 1994-09-27 | |||
| JP2010116444A | 2010-05-27 | |||
| JP2010084128A | 2010-04-15 | |||
| JPH04335080A | 1992-11-24 | |||
| JPH06271834A | 1994-09-27 | |||
| JPH07258620A | 1995-10-09 | |||
| JPH0347825A | 1991-02-28 | |||
| JPS6270405A | 1987-03-31 | |||
| JPH09272714A | 1997-10-21 | |||
| JPS59168014A | 1984-09-21 | |||
| JPS60228516A | 1985-11-13 | |||
| JPS6023405A | 1985-02-06 |
Other References:
See also references of EP 2578657A4
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
KANEKA Co. (JP)
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Claims: