Title:
MOISTURE-PROOF PAPER AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/004665
Kind Code:
A1
Abstract:
Provided are: a moisture-proof paper that can increase dampproofness of a package and maintain the dampproofness even after the package is opened while ensuring recycling efficiency; and a package formed by using the moisture-proof paper. A moisture-proof paper (100) is provided with a paper base (1) and a moisture-proof layer (2) laminated on the paper base (1). The moisture-proof layer (2) contains a styrene acryl copolymer in which a copolymer of a styrene and a (meth)acrylate is forming a core-shell structure. The moisture-proof layer preferably further contains a wax. The wax is more preferably present in the core-shell structure of the copolymer of the styrene and the (meth)acrylate.
Inventors:
KIKUCHI HIROSHI (JP)
Application Number:
PCT/JP2023/022185
Publication Date:
January 04, 2024
Filing Date:
June 15, 2023
Export Citation:
Assignee:
DIC GRAPHICS CORP (JP)
International Classes:
D21H19/20; B32B27/10; B65D65/40; B65D81/24; D21H19/18; D21H19/22
Domestic Patent References:
| WO2022071261A1 | 2022-04-07 |
Foreign References:
| JP2002138394A | 2002-05-14 | |||
| JP2019183370A | 2019-10-24 | |||
| JPH10226991A | 1998-08-25 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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