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Title:
MOISTURE RESISTANCE IMPROVER FOR WATER-BASED ADHESIVE FOR INORGANIC MATERIALS, AND WATER-BASED ADHESIVE FOR INORGANIC MATERIALS
Document Type and Number:
WIPO Patent Application WO/2020/021616
Kind Code:
A1
Abstract:
Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials, the moisture resistance improver (J) containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25°C (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer

Inventors:
HAYASHI MIYUKI (JP)
KITA AI (JP)
Application Number:
PCT/JP2018/027618
Publication Date:
January 30, 2020
Filing Date:
July 24, 2018
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD (JP)
International Classes:
C09J201/00; B32B19/02; C03C25/10; C04B38/00; C08J5/04; C09J11/06; C09J11/08; C09J103/02; C09J129/04; D04H1/4209; D04H1/58; D06M15/263; D21J1/08
Foreign References:
US6084021A2000-07-04
JPH11199786A1999-07-27
JP2005036204A2005-02-10
JP2013136864A2013-07-11
JP2015531014A2015-10-29
JP2005048349A2005-02-24
JPS60103070A1985-06-07
JP2009144140A2009-07-02
JP2006257595A2006-09-28
JPH05247882A1993-09-24
JP2014028939A2014-02-13
Attorney, Agent or Firm:
FURUTANI Shinya (JP)
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