Title:
MOISTURE-SENSITIVE FILM FOR HUMIDITY SENSOR AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2014/167785
Kind Code:
A1
Abstract:
This moisture-sensitive film for a humidity sensor has a polyimide formed from an organic compound which has amino groups at both ends, and which has one or two phenyl groups bonded in straight-chain fashion to the principal structure, and an organic compound in which both ends of one or more phenyl groups bonded in straight-chain fashion in the principal structure are carboxylic acid dianhydrides. The polyimide is composed of repeating basic units in which one or two phenyl groups, and an imide group bonded to this phenyl group, are contained in the organic compound having amino groups at both ends.
Inventors:
IZAWA ICHIROU (JP)
ISOGAI TOSHIKI (JP)
ISOGAI TOSHIKI (JP)
Application Number:
PCT/JP2014/001659
Publication Date:
October 16, 2014
Filing Date:
March 21, 2014
Export Citation:
Assignee:
DENSO CORP (JP)
NIPPON SOKEN (JP)
NIPPON SOKEN (JP)
International Classes:
G01N27/22
Foreign References:
| US5408381A | 1995-04-18 | |||
| JP2003232765A | 2003-08-22 | |||
| JPH0450757A | 1992-02-19 | |||
| JP2742329B2 | 1998-04-22 | |||
| JP2005257590A | 2005-09-22 | |||
| JP2005003543A | 2005-01-06 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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