MOLD APPARATUS

WIPO Patent Application WO/2019/112022

A1

This mold apparatus comprises: a distance member which is swingably supported by a holder; and a swinging device which is provided to a first mold unit and which swings the distance member. The holder is provided to the punch so as to be able to move in the press direction, and a pad is provided to the die so as to be able to move in the press direction. The distance member is able to swing between an origin position at which there is no contact with a second mold, and a prevention position which prevents the distance between the pad and holder in the pressing direction from reaching or dropping below a predetermined distance. In the pressing direction, if the direction from the second mold unit to the first mold unit is defined as a first direction, and the opposite direction is defined as a second direction, the swinging device swings the distance member from the origin position towards the prevention position in accordance with the holder moving relatively with respect to the punch in the first direction.

OOOKA KAZUNORI (JP)
ASO TOSHIMITSU (JP)
YOSHIDA HIROSHI (JP)
YASUFUKU DAISUKE (JP)
TANAKA YASUHARU (JP)
MIYAGI TAKASHI (JP)
SUZUKI JUNICHIRO (JP)
YAMAMOTO SHINOBU (JP)

PCT/JP2018/045001

June 13, 2019

December 06, 2018

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NIPPON STEEL CORP (JP)

B21D24/12; B21D22/26; B21D24/04

WO2015046023A1

2015-04-02

JP2017170482A	2017-09-28
JPH08332522A	1996-12-17
JP2006043760A	2006-02-16
JPH08276225A	1996-10-22
JP2017170482A	2017-09-28

BRIGHTAS IP ATTORNEYS (JP)

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