Title:
MOLD ATTITUDE SETTING METHOD AND MOLD ATTITUDE SETTING DEVICE FOR INJECTION MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2018/173540
Kind Code:
A1
Abstract:
[Problem] To provide a mold attitude setting method and a mold attitude setting device for an injection molding machine with which the attitude of a mold can be easily and efficiently set during mold replacement.
[Solution] A mold attitude setting method for an injection molding machine (1) comprises: a preparation step of preparing a mold attitude setting device (20) that sets the attitude of a mold set (M) when the mold set (M) is carried into an inter-platen space (14) and fixedly positioned on a platen board surface (11a); a mold carrying and fitting step of carrying the mold set (M) being suspended from hanging means (15) into the inter-platen space (14) and fitting a locating ring (13) of the mold set (M) into a fitting hole (11h) of the board surface; and a mold attitude setting step of using movement driving means (25), with the mold set (M) remaining suspended from the hanging means (15), to translate a mold end regulation member (21) toward the mold set (M) by way of guiding means (22) so as to contact an end surface of the mold set (M) in a surface contacting manner and to set the attitude of the mold set (M) in normal attitude.
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Inventors:
KITAURA ICHIRO (JP)
Application Number:
PCT/JP2018/004635
Publication Date:
September 27, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
PASCAL ENG CORP (JP)
International Classes:
B29C45/17
Domestic Patent References:
WO2016195079A1 | 2016-12-08 |
Foreign References:
JP3199306U | 2015-08-13 | |||
JP2014040087A | 2014-03-06 | |||
JP2012086492A | 2012-05-10 | |||
JP2010099958A | 2010-05-06 |
Other References:
See also references of EP 3603928A4
Attorney, Agent or Firm:
OKAMURA, Toshio (JP)
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