MOLD CLAMPING DEVICE - SUMITOMO HEAVY INDUSTRIES

Title:

MOLD CLAMPING DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/035745

Kind Code:

A1

Abstract:

A mold clamping device whose axial dimension can be reduced. The mold clamping device has a first fixed member (11) on which a fixed mold (15) is installed, a first movable member (12) placed so as to face the first fixed member (11) and on which a movable mold (16) is installed, a second movable member (22) moved as the first movable member (12) is advanced and retreated, a mold clamping force transmission member (39) for connecting the first and second movable members (12, 22), and a drive section (28) for performing mold opening and closing by advancing and retreating the first movable member (12). The drive section (28) for mold opening and closing and at least a part of the mold clamping force transmission member (39) are overlapped on each other. In this case, because of the overlap, the axial dimension of the mold clamping device (10) can be reduced.

Inventors:

TOKUI YOUSUKE (JP)
MORITANI KOUJI (JP)

Application Number:

PCT/JP2005/017699

Publication Date:

April 06, 2006

Filing Date:

September 27, 2005

Export Citation:

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Assignee:

SUMITOMO HEAVY INDUSTRIES (JP)
TOKUI YOUSUKE (JP)
MORITANI KOUJI (JP)

International Classes:

B29C45/66

Domestic Patent References:

WO1992009416A1	1992-06-11
WO2001038069A1	2001-05-31

Foreign References:

JPS61154823A	1986-07-14
DE3715161A1	1987-11-19
JP3190600B2	2001-07-23
JPH0434929B2	1992-06-09
DE3715161A1	1987-11-19
JPS61154822A	1986-07-14

Other References: