Title:
MOLD CLAMPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/171029
Kind Code:
A1
Abstract:
Provided is a mold clamping device of which the number of components and the structure can be simplified by providing a mold thickness adjusting mechanism in which a load acting on a power source is reduced, maintenance of which is easy, and which has a high degree of design freedom. Also provided is a mold clamping device with which it is possible to increase the set distance between molds (daylight) without increasing the overall size of the mold clamping device, and of which the number of components and the structure can be simplified.
Provided are a mold clamping device and a mold clamping device for a split mold, characterized in being provided with a first mold plate, a second mold plate, a pressure receiving plate, and a mold thickness adjusting mechanism with which the pressure receiving plate is provided, wherein: at least one of the first and second mold plates is capable of moving forward and backward in such a way as to move closer to or away from the other; the pressure receiving plate is positioned on the opposite side to the first mold plate as seen from the second mold plate; and the mold thickness adjusting mechanism is provided with a rod-shaped rotating member, a power source which causes the rotating member to rotate about an axis of rotation in the longitudinal direction thereof, and a pair of converting portions which convert the rotation of the rotating member to the direction of movement of the second mold plate. Also provided is a mold clamping device characterized in being provided with polygonal first and second mold plates, a pressure receiving plate, and a toggle mechanism, wherein: at least one of the first and second mold plates is capable of moving forward and backward in such a way as to move closer to or away from the other; the pressure receiving plate is positioned on the opposite side to the first mold plate as seen from the second mold plate; the toggle mechanism is located between the second mold plate and the pressure receiving plate, and causes the first and second mold plates to move closer to or away from one another; and the toggle mechanism is disposed on a diagonal of the second mold plate.
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Inventors:
ONO YOSHINORI (JP)
SHIMADA KENGO (JP)
MUROYA YOSUKE (JP)
ITO SHUJI (JP)
SHIMADA KENGO (JP)
MUROYA YOSUKE (JP)
ITO SHUJI (JP)
Application Number:
PCT/JP2017/013662
Publication Date:
October 05, 2017
Filing Date:
March 31, 2017
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C45/66; B29C33/22
Foreign References:
| JPH07137104A | 1995-05-30 | |||
| JPH0839638A | 1996-02-13 | |||
| JPH08323828A | 1996-12-10 | |||
| JP2014069417A | 2014-04-21 | |||
| JPH08216239A | 1996-08-27 |
Other References:
See also references of EP 3437824A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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