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Patent Searching and Data


Title:
MOLD COMPONENT MANUFACTURING METHOD AND MOLD COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/225803
Kind Code:
A1
Abstract:
A mold component manufacturing method provided with: a step of forming a first surface by removing from a worn mold component a predetermined region including a worn portion; and a step of overlaying steel material on the first surface.

Inventors:
OOTAKI TAKANORI (JP)
Application Number:
PCT/JP2018/021779
Publication Date:
December 13, 2018
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC SINTERED ALLOY LTD (JP)
International Classes:
B23K26/21; B21C25/02; B23K26/342
Foreign References:
JPH0475726A1992-03-10
JP2008254025A2008-10-23
JPS57118830A1982-07-23
JP2016117276A2016-06-30
Attorney, Agent or Firm:
YAMANO, Hiroshi (JP)
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