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Patent Searching and Data


Title:
MOLD DEVICE FOR INJECTION MOLDING AND METHOD FOR PRODUCING MOLDED ARTICLE USING MOLD DEVICE FOR INJECTION MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/151343
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a mold device for injection molding, the device including a hot raw-resin flow path that is connected to a mold cavity through a gate. A heat transfer control unit is provided at least in a region that is proximate to the gate.

Inventors:
MORIMOTO, Masanori
TANAKA, Kenichi
ABE, Satoshi
UCHINONO, Yoshiyuki
WATANABE, Shinya
Application Number:
JP2019/003225
Publication Date:
August 08, 2019
Filing Date:
January 30, 2019
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
B29C45/27; B22F3/105; B22F3/16; B29C45/73; B33Y30/00
Foreign References:
JPH06328537A1994-11-29
JP2006526521A2006-11-24
JP2017159555A2017-09-14
Attorney, Agent or Firm:
YAMAO, Norihito et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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