Title:
MOLD DISASSEMBLY METHOD AND INSTALLATION THEREFOR
Document Type and Number:
WIPO Patent Application WO/2006/068029
Kind Code:
A1
Abstract:
A mold disassembly method and installation, in which dents on a product occurring during mold disassembly can be reduced. The method has the following processes: a process of placing an upper mold with an upper frame on a lower mold with a lower frame to join the molds such that a pouring gate faces upward, and then inverting the upper and lower molds, which have the upper and lower frames and into which a molten material has been poured, to make the pouring gate face downward, and a process of drawing out the upper and lower molds and a product from the upper and lower molds, which have the upper and lower frames and whose pouring gate faces downward by the inversion, from the above to below.
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Inventors:
Kawai, Nobuyuki c/o Sintokogio Ltd. (Toyokawa Seisakusho, 1, Honohara 3-chom, Toyokawa-shi Aichi 61, 44200, JP)
Application Number:
PCT/JP2005/023057
Publication Date:
June 29, 2006
Filing Date:
December 15, 2005
Export Citation:
Assignee:
SINTOKOGIO, LTD. (28-12, Meieki 3-chome Nakamura-k, Nagoya-shi Aichi 02, 45000, JP)
Kawai, Nobuyuki c/o Sintokogio Ltd. (Toyokawa Seisakusho, 1, Honohara 3-chom, Toyokawa-shi Aichi 61, 44200, JP)
Kawai, Nobuyuki c/o Sintokogio Ltd. (Toyokawa Seisakusho, 1, Honohara 3-chom, Toyokawa-shi Aichi 61, 44200, JP)
International Classes:
B22D29/04
Attorney, Agent or Firm:
Yamasaki, Yukuzo (Yamasaki & Partners, Sogo Nagatacho Bldg. 8F 11-28, Nagatacho 1-chom, Chiyoda-ku Tokyo 14, 10000, JP)
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