Title:
MOLD FABRICATED BY ELECTROFORMING AND METHOD FOR FABRICATING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131960
Kind Code:
A1
Abstract:
The present invention relates to a technology for fabricating a three-dimensional electroformed object or circuit, a flexible circuit board, a mesh, a filter, a three-dimensional MEMS component, a three-dimensional circuit, a three-dimensional super-precision structure, a transparent heating wire, a chip-on film, an electromagnetic wave blocking sheet, and the like, which have pitch sizes of tens of micrometers and have line width sizes of several micrometers. These are mainly produced by making molds. A mold made to enable electroforming/plating is referred to as an electroforming mold according to the present invention. The present invention provides vertically growing electroforming/plating that causes an electroformed object to grow in the vertical direction when the electroforming mold is used. The present invention sets forth, as claims, contents regarding a product, a mold for making the product, a method for fabricating the same, and an article made by the method. As the most basic method for fabricating an electroforming mold, according to the present invention, a photosensitive layer is initially formed on a substrate. The photosensitive layer undergoes exposure and development processes such that a protruding portion and a space portion are formed on the substrate. The width of the upper portion of the protruding portion is smaller than the width of the power portion of the protruding portion such that the same has a tapered shape and thus facilitates mold releasing. An electroforming mold used in the present invention has a protruding portion and a space portion. The space portion is filled with a nonconductive material, is coated with the same, or has the same applied thereto. The nonconductive material used for filling, coating, or application prevents formation of plating on the bottom portion of the space portion and on the side wall surface thereof. The nonconductive material is configured in a parabolic shape mainly in the space portion. When the same is configured in a deep parabolic shape, a plating solution is entrapped inside the parabolic shape, thereby forming a stagnation area. The vertically growing electroforming mold according to the present invention is characterized in that such a stagnation area is configured. When electroforming is performed using the vertically growing electroforming mold according to the present invention, the electroformed object mainly grows vertically, together with a small degree of horizontal growth. The present invention is characterized in that, as the electroformed object grows vertically, the stagnation area rises to the upper portion together.
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Inventors:
SEONG NAK HOON (KR)
Application Number:
PCT/KR2018/000666
Publication Date:
July 19, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
SEONG NAK HOON (KR)
International Classes:
C25D1/10; C23C14/34; C25D1/00; C25D1/08; C25D1/20; H01L21/203; H05K1/03; H05K3/00; H05K3/28
Foreign References:
| KR20140094315A | 2014-07-30 | |||
| KR100980217B1 | 2010-09-06 | |||
| KR20160092686A | 2016-08-05 | |||
| KR20140033736A | 2014-03-19 | |||
| KR20040055536A | 2004-06-26 | |||
| KR20160104346A | 2016-09-05 |
Attorney, Agent or Firm:
SUNG, Nak Jun (KR)
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