Title:
MOLD FOR FORMING LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2010/095841
Kind Code:
A2
Abstract:
The present invention relates to a mold for forming an LED lens having a novel structure, which enables the easy injection of resin and prevents residuals from remaining around a reflector during a lens molding process. According to the present invention, when an intermediate panel (14) is coupled onto the upper portion of a substrate (1) such that a reflector (3) is fitted into a through-hole (14a), a stopper protrusion (14b) formed at the through-hole (14a) presses the circumference of the upper surface of the reflector (3) to divide the upper surface and the circumference of the reflector (3). Thus, resin introduced into a cavity (13) through a runner (11) and a gate (12) is leaked onto the circumference of the reflector (3), to thereby prevent residuals from remaining around the reflector, and the cross-section area of the gate (12) is widened to enable easy injection of the resin.
Inventors:
LEE KYUNG JOON (KR)
JEONG DAE SUNG (KR)
JEONG DAE SUNG (KR)
Application Number:
PCT/KR2010/000948
Publication Date:
August 26, 2010
Filing Date:
February 16, 2010
Export Citation:
Assignee:
CHAMTECH CO LTD (KR)
LEE KYUNG JOON (KR)
JEONG DAE SUNG (KR)
LEE KYUNG JOON (KR)
JEONG DAE SUNG (KR)
International Classes:
B29D11/00
Foreign References:
| JP4211359B2 | 2009-01-21 | |||
| KR20070008269A | 2007-01-17 | |||
| KR20090001108A | 2009-01-08 | |||
| KR20070117865A | 2007-12-13 |
Attorney, Agent or Firm:
LEE, DAE SUN (KR)
이대선 (KR)
이대선 (KR)
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