Title:
MOLD HAVING RELEASE LAYER FOR IMPRINTING, METHOD FOR PRODUCING MOLD HAVING RELEASE LAYER FOR IMPRINTING, AND METHOD FOR PRODUCING COPY MOLD
Document Type and Number:
WIPO Patent Application WO/2011/122605
Kind Code:
A1
Abstract:
Provided is a mold having a release layer, in which the release layer is disposed in the mold which transfers a specific uneven pattern onto a molding material to be patterned by means of the imprinting method, wherein the main chain of the molecular chains of a compound contained in the release layer contains fluorocarbons, the molecular chains of the compound have at least two adsorption functional groups that are adsorbed or bonded to the mold, the bonding energy in the adsorption functional groups that becomes the source of adsorption or bonding of the adsorption functional groups to the mold is greater than the bonding energy between one adsorption functional group and another adsorption functional group in the molecular chains of the compound, and the surface free energy of the release layer is optimized by means of heating.
Inventors:
SUZUKI Kota (C/O HOYA CORPORATION, 7-5 Nakaochiai 2-chome, Shinjuku-k, Tokyo 25, 〒1618525, JP)
鈴木 宏太 (〒25 東京都新宿区中落合二丁目７番５号 ＨＯＹＡ株式会社内 Tokyo, 〒1618525, JP)
鈴木 宏太 (〒25 東京都新宿区中落合二丁目７番５号 ＨＯＹＡ株式会社内 Tokyo, 〒1618525, JP)
Application Number:
JP2011/057762
Publication Date:
October 06, 2011
Filing Date:
March 29, 2011
Export Citation:
Assignee:
HOYA CORPORATION (7-5 Nakaochiai 2-chome, Shinjuku-ku Tokyo, 25, 〒1618525, JP)
ＨＯＹＡ株式会社 (〒25 東京都新宿区中落合二丁目７番５号 Tokyo, 〒1618525, JP)
SUZUKI Kota (C/O HOYA CORPORATION, 7-5 Nakaochiai 2-chome, Shinjuku-k, Tokyo 25, 〒1618525, JP)
ＨＯＹＡ株式会社 (〒25 東京都新宿区中落合二丁目７番５号 Tokyo, 〒1618525, JP)
SUZUKI Kota (C/O HOYA CORPORATION, 7-5 Nakaochiai 2-chome, Shinjuku-k, Tokyo 25, 〒1618525, JP)
International Classes:
B29C59/02; B29C33/38; H01L21/027
Attorney, Agent or Firm:
ANIYA Setuo et al. (21 TOWA BLDG. 3F, 6-1 Iidabashi 4-chome, Chiyoda-k, Tokyo 72, 〒1020072, JP)
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Claims: