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Patent Searching and Data


Title:
MOLD FOR MOLDING, AND MOLDING SYSTEM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2011/149243
Kind Code:
A2
Abstract:
According to the present invention, a mold for molding comprises: a plurality of molding plates for forming a cavity for molding; a porous member which is inserted into a passage formed inside at least one of the molding plates, and which has pores having an open cell structure for enabling a fluid to pass through the porous member; and an insert which is inserted into an insertion hole formed in the porous member along the fluid flow direction. The mold for molding according to the present invention is configured such that the insert enables a heat transfer medium introduced into the porous member to be concentrated at the contact surface between the porous member and the molding plate, at which heat exchange between the heat transfer medium and the molding plate is relatively actively performed, thereby enabling quick heat transfer between the heat transfer medium and the molding plate, and thus improving heating efficiency and cooling efficiency.

Inventors:
KANG, Myung Ho (#102-101 Bangbae 1-cha Hyundai Apt, 1344 Bangbae-dong Seocho-gu, Seoul 137-937, 137-937, KR)
Application Number:
KR2011/003791
Publication Date:
December 01, 2011
Filing Date:
May 24, 2011
Export Citation:
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Assignee:
NADA INNOVATION CO.,LTD (#305, Soonchunhyang University Industry-academic Cooperation a building646, Eupnae-ri, Shinchang-myun, Asan-si, Chungcheongnam-do 336-745, 336-745, KR)
주식회사 나다이노베이션 (충청남도 아산시 신창면 읍내리 646 순천향 대학교 산학협동관 305, 336-745 Chungcheongnam-do, 336-745, KR)
International Classes:
B29C45/14; B29C45/73; B29C45/78
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (3rd Floor, Shinmyeong Building645-21 Yeoksam-dong, Gangnam-gu, Seoul 135-910, 135-910, KR)
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Claims: