Title:
MOLD ORGANIC BINDER, AND MOLDING SAND COMPOSITION AND MOLD OBTAINED USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/195406
Kind Code:
A1
Abstract:
Provided is a mold organic binder that exhibits an excellent fast curing property and can shorten the molding time when a mold is manufactured through ordinary temperature curing. The mold organic binder used to mold a phenolic urethane-based gas-curing mold or a self-curing mold is formed using, as essential components, a phenol resin, an organic solvent, and a reaction product of i) a polyisocyanate compound and ii) a compound a having two or three intramolecular hydroxyl groups and/or carboxyl groups and having a number average molecular weight of 300-3000, the proportion of the compound a in relation to the polyisocyanate compound being 0.1-12.0 mass%.
Inventors:
ISHIDA YASUHIDE (JP)
FUKATSU AKINOBU (JP)
FUKATSU AKINOBU (JP)
Application Number:
PCT/JP2023/013085
Publication Date:
October 12, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
ASAHI YUKIZAI CORP (JP)
International Classes:
B22C1/22; B22C1/10; B22C9/12; C08G18/10; C08G18/54
Foreign References:
| JP2006272366A | 2006-10-12 | |||
| US4946876A | 1990-08-07 |
Attorney, Agent or Firm:
NAKASHIMA, Michio et al. (JP)
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