MOLD ORGANIC BINDER, AND MOLDING SAND COMPOSITION AND MOLD OBTAINED USING SAME

Title:

MOLD ORGANIC BINDER, AND MOLDING SAND COMPOSITION AND MOLD OBTAINED USING SAME

Document Type and Number:

WIPO Patent Application WO/2024/071282

Kind Code:

A1

Abstract:

Provided is a mold organic binder that has an exceptional curing speed during molding and that yields a mold exhibiting exceptional strength.　This mold organic binder is configured using triethylenediamine together with one or more resins that serve as a resin adhesion component, the one or more resins being selected from the group consisting of cresol-modified novolac phenolic resins, novolac cresol resins, xylenol-modified novolac phenolic resins, and novolac xylenol resins.

Inventors:

MAEDA HIRONOBU (JP)

Application Number:

PCT/JP2023/035353

Publication Date:

April 04, 2024

Filing Date:

September 28, 2023

Export Citation:

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Assignee:

ASAHI YUKIZAI CORP (JP)

International Classes:

B22C1/22; C08K5/09; C08K5/17; C08L61/06

Attorney, Agent or Firm:

NAKASHIMA, Michio et al. (JP)

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