Title:
MOLD PART FOR MOLDING RESIN AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/129385
Kind Code:
A1
Abstract:
A mold part (10) for molding resin includes a base material layer (12), a design section (14), and uneven sections (18) for abutting on an inner surface (m) of a molding tool (M) so as to form ventilation sections (20) with the inner surface (m), the design section (14) includes decoration sections (14a) transcribed by a reverse master having an uneven surface, at least the design section (14) of the base material layer (12) and the design section (14) is formed of a material having heat resistance, and the mold part (10) for molding resin is replaceably attached to the molding tool (M) so that molding pressure works in the direction in which the uneven sections (18) press against the inner surface (m) of the molding tool (M) during the molding of a molding product, whereby the design on the surface side of the product can be easily changed without requiring great efforts and cost, leading to a variety of selections of post-treatment to the design surface.
Inventors:
YONESHIMA, Sadayuki (1-10, Nishiishikiri-cho 2-chome, Higashiosaka-sh, Osaka 13, 〒5798013, JP)
米島 貞行 (〒13 大阪府東大阪市西石切町２丁目１番１０号 株式会社棚澤八光社内 Osaka, 〒5798013, JP)
米島 貞行 (〒13 大阪府東大阪市西石切町２丁目１番１０号 株式会社棚澤八光社内 Osaka, 〒5798013, JP)
Application Number:
JP2011/059238
Publication Date:
October 20, 2011
Filing Date:
April 14, 2011
Export Citation:
Assignee:
TANAZAWA HAKKOSHA CO., LTD. (1-10, Nishiishikiri-cho 2-chome Higashiosaka-sh, Osaka 13, 〒5798013, JP)
株式会社棚澤八光社 (〒13 大阪府東大阪市西石切町２丁目１番１０号 Osaka, 〒5798013, JP)
YONESHIMA, Sadayuki (1-10, Nishiishikiri-cho 2-chome, Higashiosaka-sh, Osaka 13, 〒5798013, JP)
株式会社棚澤八光社 (〒13 大阪府東大阪市西石切町２丁目１番１０号 Osaka, 〒5798013, JP)
YONESHIMA, Sadayuki (1-10, Nishiishikiri-cho 2-chome, Higashiosaka-sh, Osaka 13, 〒5798013, JP)
International Classes:
B29C33/38; B29C51/36
Attorney, Agent or Firm:
OKADA, Masahiro (3rd Floor Iyo Building, 2-21, Minamihonmachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
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Claims: