Title:
MOLD FOR POLYMERIC COMPOSITE MOLDING USING INDUCED HEATING OF DIELECTRIC MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/121118
Kind Code:
A1
Abstract:
The present invention relates to a mold device for polymeric composite molding and, specifically, to a mold device for polymeric composite molding to mold a polymeric resin or a polymeric composite by using induced heating of a carbon nanomaterial contained in a mold main body.
Inventors:
CHEON JINSIL (KR)
LEE SANG JIN (KR)
LEE SANG JIN (KR)
Application Number:
PCT/KR2022/020272
Publication Date:
June 29, 2023
Filing Date:
December 13, 2022
Export Citation:
Assignee:
KOREA TEXTILE MACHINERY CONVERGENCE RES INSTITUTE (KR)
International Classes:
B29C33/06; B29C33/38; B29C35/08; B29C70/46; H05B6/36
Foreign References:
| KR101182609B1 | 2012-09-17 | |||
| KR101097285B1 | 2011-12-21 | |||
| KR20210005852A | 2021-01-15 | |||
| JP6403421B2 | 2018-10-10 | |||
| KR102309869B1 | 2021-10-07 | |||
| JP6508056B2 | 2019-05-08 |
Attorney, Agent or Firm:
GHONG-GAN INTERNATIONAL PATENT LAW FIRM (KR)
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