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Title:
MOLD RELEASE AGENT CONTAINING SOLID RESIN
Document Type and Number:
WIPO Patent Application WO/2019/111798
Kind Code:
A1
Abstract:
[Problem] To provide a mold release agent containing a solid resin. [Solution] The present invention provides a mold release agent containing component (A), component (B), component (C), and component (D) below. (A): a multifunctional (meth)acrylate compound having a polymerizable group at each end of a linear or chained molecular chain via a urethane bond, the polymerizable group containing a group represented by formula (3), and the linear or chained molecular chain containing a group represented by formula (1) and a group represented by formula (2a) or (2b), (B): 1-100 phr of a resin which is in a solid state at 23°C and 1013.25 hPa, (C): a photopolymerization initiator, (D): a solvent (in the formulae, R1 represents a C1 or C2 perfluoro alkylene group, R2a represents a C2 or C3 alkylene group, R2b represents a C2 or C3 trivalent hydrocarbon group, each * represents a dangling bond that bonds to a -O- group of the urethane bond, p and q represent the number of groups represented by formula (1) and the number of groups represented by formula (2a), respectively, and each independently represent an integer of at least 2, and R3 represents a methyl group or a hydrogen atom)

Inventors:
SUGAWARA YUKI (JP)
SHUTO KEISUKE (JP)
NAGASAWA TAKEHIRO (JP)
Application Number:
PCT/JP2018/044000
Publication Date:
June 13, 2019
Filing Date:
November 29, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
B29C33/60; C08F299/02
Domestic Patent References:
WO2012105340A12012-08-09
Foreign References:
JP2017203908A2017-11-16
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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