Title:
MOLD RELEASE FILM AND METHOD FOR MANUFACTURING MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/085242
Kind Code:
A1
Abstract:
This mold release film (10) comprises a mold release layer (1) on at least one surface thereof. The mold release layer (1) includes at least one type selected from a polyester resin, a poly 4–methyl-1–pentene resin, a polyamide resin, and a polypropylene resin. The tack strength thereof measured under the following conditions is 150–700 gf. Conditions: Tack strength is the load (gf) applied when a circular surface of stainless steel that has a diameter of 5 mm is pressed onto a surface on the mold release layer (1) side of the mold release film (10), at a pressing speed of 2 mm/s, held at a temperature of 175°C and a pressure of 4,000 gf for a pressurization time of 150 s, and then peeled from the surface on the mold release layer (1) side at a peeling speed of 10 mm/s.
Inventors:
ENOMOTO YOSUKE (JP)
Application Number:
PCT/JP2021/025242
Publication Date:
April 28, 2022
Filing Date:
July 05, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B29C33/68; H05K1/03
Domestic Patent References:
| WO2017200102A1 | 2017-11-23 |
Foreign References:
| JP2019043135A | 2019-03-22 | |||
| JP2016002730A | 2016-01-12 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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